Organic Semiconductor Compound for Flexible Display Transistors
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Solution Overview
Problem
Conventional amorphous silicon thin film transistors face challenges in high-temperature processing, making it difficult to apply them to flexible polymer substrates, and there is a need for organic semiconductor compounds with low bandgap and high charge mobility for flexible display devices.
Innovation Solution
Development of an organic semiconductor compound with a specific structural unit, represented by Chemical Formula 1, that can be processed at room temperature using a solution method, enabling the formation of an organic thin film transistor (OTFT) with improved charge mobility and solubility for flexible displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional amorphous silicon thin film transistor is used, then uniformity and electrical characteristics are improved, but high-temperature processing requirement makes it difficult to apply to polymer substrates
Solution Approach 1:
The patent changes the material parameter from inorganic amorphous silicon to organic semiconductor compound, which fundamentally alters the processing temperature requirement. The organic semiconductor compound can be processed at low temperatures (room temperature to 150°C) while maintaining good electrical characteristics, thus resolving the contradiction between reliability and temperature constraint.
Solution Approach 2:
The patent uses organic semiconductor compound as a composite material that combines the advantages of both inorganic and organic materials. This composite material achieves the desired electrical properties similar to amorphous silicon while enabling low-temperature processing, making it suitable for polymer substrates.
2Reliability
If organic semiconductor compound with low bandgap and high charge mobility is developed, then charge mobility is improved, but material complexity increases
Solution Approach 1:
The patent segments the organic semiconductor compound into distinct structural components: a core unit (Formula 1) and substitutable groups (R1-R6). This segmentation allows systematic design and optimization of charge mobility by adjusting specific groups while maintaining overall material simplicity and processability.
Solution Approach 2:
The patent optimizes the bandgap and charge mobility parameters by adjusting the structural parameters of the organic semiconductor compound (substituents R1-R6, core unit structure). This parameter optimization achieves high charge mobility without excessive material complexity, as the changes are made within a systematic framework.
3Ease of manufacture
If solution process is used for large-area processing, then manufacturing cost is reduced, but processing temperature must be low
Solution Approach 1:
The patent changes the thermal stability parameter of the organic semiconductor compound to enable low-temperature solution processing. The compound maintains sufficient thermal stability during solution-based fabrication (room temperature to 150°C) to achieve good film quality and electrical characteristics, thus enabling cost-effective large-area manufacturing.
Solution Approach 2:
The patent replaces high-temperature thermal processing with low-temperature solution processing. Instead of using thermal deposition or high-temperature annealing, the invention uses solution-based methods (spin coating, inkjet printing, etc.) at low temperatures, substituting the thermal field with a chemical solution process for manufacturing.
Data Source
AI summary
An organic semiconductor compound may include a structural unit represented by the aforementioned Chemical Formula 1 and an organic thin film and an electronic device may include the organic semiconductor compound.