Organic Semiconductor Compound with Inorganic Protective Layers
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Solution Overview
Problem
Organic semiconductor devices are sensitive to external environments and lack durability, which affects their electrical characteristics and reliability, particularly in flexible electronic applications.
Innovation Solution
An organic semiconductor compound with a precursor structure that forms a three-dimensional network through hydrolysis and condensation reactions, combined with a self-assembled monolayer and insulating layers, enhances durability and binding forces, allowing for improved current-voltage characteristics and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic semiconductor materials are used to form channels in semiconductor devices, then the devices can be fabricated with flexible materials and simplified processing, but the electrical characteristics and durability deteriorate due to sensitivity to external environment
Solution Approach 1:
The patent applies composite materials by combining organic semiconductor materials with inorganic materials (such as metal oxides like Al2O3, SiO2, TiO2, or ZrO2) to form a composite structure. This composite approach allows the device to retain the ease of manufacture and flexibility of organic materials while gaining the durability and environmental stability of inorganic materials, directly resolving the contradiction between ease of manufacture and reliability
Solution Approach 2:
The patent uses thin film structures where organic semiconductor layers are deposited as thin films on substrates, and inorganic materials are used as protective layers or interface layers. This thin film configuration maintains the flexibility and lightweight characteristics of organic materials while providing protection against environmental factors, thus improving durability without sacrificing the ease of manufacture
2Stability of the object's composition
If organic semiconductor materials are used in flexible electronic devices, then device flexibility and weight are improved, but sensitivity to external environment increases reducing device stability
Solution Approach 1:
The patent employs inorganic materials (metal oxides such as Al2O3, SiO2, TiO2, ZrO2) as protective layers that create an inert environment for the organic semiconductor materials. These inorganic layers act as barriers against oxygen, moisture, and other harmful external factors, thereby reducing the sensitivity to external environment and improving the stability of the device composition
Solution Approach 2:
By creating a composite structure where inorganic materials encapsulate or interface with organic semiconductor materials, the patent protects the sensitive organic components from external environmental factors while maintaining the overall device flexibility and stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides chemical and etching resistance, maintains optoelectrical characteristics, and enhances the binding force between layers, leading to improved stability and efficiency in flexible electronic devices.
Implementation Method 1
the precursor structure may be formed by gelating an organometallic precursor by hydrolysis and condensation reaction
Implementation Method 2
the precursor structure may be formed by gelating an organometallic precursor by hydrolysis and condensation reaction
Implementation Method 3
the precursor structure and the organic semiconductor penetrate each other to form a three-dimensional network structure
Implementation Method 4
a self-assembled monolayer formed on the organic semiconductor layer using a self-assembling precursor
Implementation Method 5
the self-assembled monolayer is formed through a chemical bond between the reactive groups and the self-assembling precursor
Data Source
AI summary
Disclosed are an organic semiconductor compound that exhibits chemical resistance and etch resistance while maintaining electrical characteristics and thus is applicable to an existing photolithography process, thereby increasing process efficiency, and an organic semiconductor device using the same.