Organic Semiconductor Polymer Blend with Isolating Polymer

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Solution Overview

Problem

Existing organic semiconductor devices face performance degradation when annealed in air due to oxidation, leading to reduced charge carrier mobility and On/Off ratio, which is not effectively addressed by current technologies.

Innovation Solution

A polymer blend comprising an organic semiconductor polymer and an isolating polymer, such as polystyrene, is used, where the isolating polymer forms an encapsulating layer or oxidizes preferentially to prevent air oxidation, maintaining device performance even when annealed in air.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If organic semiconductor devices are annealed in air to improve thermal processing, then thermal stability is improved, but oxidation occurs leading to reduced charge carrier mobility and On/Off ratio

Engineering Contradiction:

Improvethermal stabilityVSAvoidcharge carrier mobility

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

A sacrificial polymer component is introduced as an intermediary substance that preferentially reacts with oxygen during annealing. This mediator protects the organic semiconductor by consuming oxidizing agents, thereby maintaining charge carrier mobility while allowing thermal processing to proceed.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful oxidation effect is converted into a beneficial protective mechanism. The sacrificial polymer deliberately undergoes oxidation to form a protective layer or consume oxygen, thereby preventing oxidation of the organic semiconductor and maintaining device performance after annealing.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Temperature

If organic semiconductor devices are annealed in air to improve thermal processing, then thermal stability is improved, but On/Off ratio decreases due to oxidation

Engineering Contradiction:

Improvethermal stabilityVSAvoidOn/Off ratio

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The sacrificial polymer acts as a mediator between oxygen and the organic semiconductor, preferentially reacting with oxygen to form a protective barrier. This intermediary layer prevents oxygen from reaching the semiconductor, thereby preserving the On/Off ratio during thermal annealing processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sacrificial polymer provides beforehand cushioning by being positioned to react with oxygen before it can reach the organic semiconductor. This prior protective action cushions the semiconductor against oxidation damage during annealing, maintaining device characteristics.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If a polymer blend with isolating polymer is used to prevent oxidation, then charge carrier mobility is maintained, but device complexity increases

Engineering Contradiction:

Improvecharge carrier mobilityVSAvoidpolymer blend composition

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A composite polymer blend is formulated combining the organic semiconductor with a sacrificial polymer component. This composite material integrates oxidation protection functionality directly into the semiconductor layer, maintaining charge carrier mobility while avoiding the need for separate protective layers or complex multi-layer structures.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The sacrificial polymer component provides multiple functions within a single material: it serves as a processing aid, an oxidation protector, and a structural matrix. This multi-functionality reduces overall device complexity by eliminating the need for separate components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polymer blend enhances the thermal stability and performance of organic semiconductor devices by preventing oxidation, maintaining high charge carrier mobility and On/Off ratio, even when annealed in air, thus overcoming the limitations of existing technologies.

Implementation Method 1

the isolating polymer oxidizes preferentially to the organic semiconductor polymer

Methodology Applied

Scientific EffectOxidation: Oxidation

Implementation Method 2

the isolating polymer forms an encapsulating layer between the organic semiconductor and an air interface

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS11283023B2Doping of other polymers into organic semi-conducting polymers

Publication Date: 2022.03.22 CORNING INC

AI summary

Disclosed is a polymer blend comprising an organic semiconductor (OSC) polymer blended with an isolating polymer and method for making the same. The OSC polymer includes a diketopyrrolopyrrole fused thiophene polymeric material, and the fused thiophene is beta-substituted. The isolating polymer includes a non-conjugated backbone, and the isolating polymer may be one of polyacrylonitrile, alkyl substituted polyacrylonitrile, polystyrene, polysulfonate, polycarbonate, an elastomer block copolymer, derivatives thereof, copolymers thereof and mixtures thereof. The method includes blending the OSC polymer with an isolating polymer in an organic solvent to create a polymer blend and depositing a thin film of the polymer blend over a substrate. Also disclosed is an organic semiconductor device that includes a thin semiconducting film comprising OSC polymer.