Thin Organic Substrate Light Emitting Module for Display Devices
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Solution Overview
Problem
Current light emitting modules, particularly in display technology, face challenges in achieving a thin, efficient, and durable design that balances light transmission uniformity, high contrast, and reduced thickness, especially with the integration of Mini LED technology.
Innovation Solution
A light emitting module is designed with a thin organic substrate (5 μm to 10 μm thick) directly attached to a back frame using a bonding portion, incorporating a Mini LED chip array, encapsulation layer, and a color conversion layer, along with a display panel and optical film group, to enhance heat dissipation, structural strength, and light uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin organic substrate is used to reduce module thickness, then the overall thickness is reduced, but the structural strength and heat dissipation capability deteriorate
Solution Approach 1:
The patent employs a thin organic substrate (5-10 μm) as a flexible film structure that provides sufficient mechanical support for the light emitting elements while enabling ultra-thin module design. The substrate's flexibility allows it to conform to the back frame structure and maintain structural integrity despite its minimal thickness.
Solution Approach 2:
The patent uses composite material structures including the organic substrate combined with inorganic encapsulation layers and metal back frame. This composite approach allows each material to contribute its strengths: the organic substrate provides flexibility and thinness, while the metal back frame provides structural support and heat dissipation.
2Length of moving object
If a thin organic substrate is used to reduce module thickness, then the overall thickness is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a bonding portion as an intermediary component between the thin organic substrate and the metal back frame. This bonding layer facilitates thermal transfer from the substrate to the heat-dissipating back frame while maintaining the thin profile of the overall module.
Solution Approach 2:
The composite structure combines the thin organic substrate with a metal back frame having high thermal conductivity. The metal back frame serves as a heat sink, drawing thermal energy away from the light emitting elements through the bonding portion, thereby compensating for the limited heat dissipation capacity of the thin substrate.
3Length of moving object
If the substrate thickness is reduced to achieve ultra-thin design, then the module becomes thinner, but the manufacturing precision and alignment difficulty increase
Solution Approach 1:
The patent implements preliminary positioning structures and alignment marks during the manufacturing process. The back frame and substrate are designed with pre-established alignment features that guide the precise placement of the thin substrate onto the back frame, compensating for the difficulty of handling ultra-thin materials.
Solution Approach 2:
The bonding portion serves as an intermediary layer that facilitates precise alignment and secure attachment of the thin substrate to the back frame. This bonding layer provides a controlled interface that allows for accurate positioning while accommodating the flexibility of the thin organic substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a thinner, more efficient light emitting module with improved heat dissipation, higher contrast, and uniform light transmission, achieving an ultra-thin design while maintaining high dynamic contrast and precise dimming capabilities.
Implementation Method 1
a bonding portion disposed between the back frame and the first substrate, wherein the bonding portion includes a first surface facing the back frame and a second surface facing the first substrate
Implementation Method 2
Mini Light Emitting Diode (Mini LED) has gradually become a research hotspot in the field of display technology
Implementation Method 3
the color conversion layer includes a KSF phosphor
Implementation Method 4
an encapsulation layer disposed on the first substrate and covering the electronic element array
Data Source
AI summary
A light emitting module, a method of manufacturing the light emitting module, and a display device are provided. The light emitting module includes: a back frame; a first substrate; an electronic element array disposed on the first substrate, wherein the electronic element array includes a plurality of electronic elements; an encapsulation layer disposed on the first substrate and covering the electronic element array; and a bonding portion disposed between the back frame and the first substrate, wherein the bonding portion includes a first surface facing the back frame and a second surface facing the first substrate, and the first surface and the second surface are oppositely disposed, wherein a material of the first substrate is an organic material, the back frame is in direct contact with the first surface of the bonding portion, and the first substrate is in direct contact with the second surface of the bonding portion.