Organic Substrate Micro Conductors Shield Electric Fields

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Solution Overview

Problem

Semiconductor devices with thin-film transistors (TFTs) face characteristic deterioration due to electric fields generated by static electricity, which existing technologies fail to adequately address, leading to performance issues.

Innovation Solution

A semiconductor device is designed with a substrate comprising an organic insulating material and dispersed micro conductors, which shields against electric fields, thereby protecting the TFTs and improving device stability and manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional substrate is used without micro conductors, then the manufacturing process is simple, but the semiconductor element suffers from characteristic deterioration due to electric fields from static electricity

Engineering Contradiction:
Improvecharacteristic stability of semiconductor elementVSAvoidsubstrate structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The substrate's electrical properties are changed by incorporating micro conductors into the organic insulating material, transforming it from a simple insulator to an electrically active component that can shield against harmful electric fields while maintaining mechanical substrate functions

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The substrate is constructed as a composite material combining organic insulating material with dispersed micro conductors, creating a new material system that simultaneously provides insulation and electromagnetic shielding properties

Inventive Principle:
Principle #40Composite materials

2Reliability

If micro conductors are added to the substrate to shield electric fields, then the semiconductor element is protected from characteristic deterioration, but the substrate manufacturing becomes more complex

Engineering Contradiction:
Improveprotection of semiconductor elementVSAvoidsubstrate manufacturing process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The substrate manufacturing process merges the formation of the organic insulating material layer with the incorporation of micro conductors into a single integrated process, eliminating the need for separate shielding layer fabrication and reducing overall manufacturing complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The micro conductors are incorporated during the substrate formation process itself, allowing the substrate to self-generate its electric field shielding capability without requiring additional protective layers or post-processing steps

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of micro conductors in the substrate effectively suppresses the influence of electric fields on TFTs, reducing characteristic deterioration and enhancing productivity while maintaining device performance.

Implementation Method 1

a substrate that includes an organic insulating material and a plurality of micro conductors dispersed in the organic insulating material

Methodology Applied
Scientific EffectElectric field shielding: Faraday Cage

Data Source

PatentUS10825882B2Semiconductor device and display unit
Publication Date: 2020.11.03 MAGNOLIA BLUE CORP
  • US10825882B2 patent drawing
  • US10825882B2 patent drawing
  • US10825882B2 patent drawing

AI summary

A display unit includes a substrate that includes an organic insulating material and a plurality of micro conductors dispersed in the organic insulating material; a semiconductor element provided on the substrate; and a display element layer that is provided on a side opposite to the substrate with respect to the semiconductor element. The display element layer includes a display surface and a plurality of display element that is driven to perform image displaying on the display surface by the semiconductor element.