Organic Substrate Singulation and Lead Frame Extension in Semiconductor Storage
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Solution Overview
Problem
Conventional semiconductor storage devices face challenges in reducing manufacturing costs due to the usage of organic substrates, which require efficient design and manufacturing methods to minimize substrate overlap and prevent short-circuits during insertion into external apparatuses.
Innovation Solution
A semiconductor storage device design featuring an organic substrate with a lead frame and resin mold unit, where the substrate is singulated to minimize overlap with the lead frame, and the lead frame's connection portions are strategically extended to enhance adhesion and prevent short-circuits, allowing for cost-effective production and reliable operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the organic substrate is reduced in size to lower manufacturing cost, then manufacturing cost decreases, but the risk of short-circuit during insertion increases
Solution Approach 1:
The lead frame is divided into distinct functional portions: a connection pad portion for electrical connection, an adhering portion for substrate attachment, and an extending portion that protrudes beyond the substrate edge. This segmentation allows each portion to be optimized independently - the connection pad portion maintains proper electrical contact while the extending portion provides mechanical guidance and prevents short-circuits during insertion, resolving the contradiction between cost reduction and reliability.
2Ease of manufacture
If the organic substrate size is minimized, then substrate usage and cost are reduced, but alignment precision during assembly becomes more difficult
Solution Approach 1:
The lead frame extends into a third dimension by protruding beyond the organic substrate edge. This vertical extension provides additional alignment features and mechanical guidance that compensate for the reduced substrate size, maintaining assembly precision while allowing minimal substrate usage. The extending portion acts as a dimensional buffer that ensures proper positioning during insertion.
3Reliability
If the lead frame connection portions are extended to prevent short-circuits, then reliability improves, but device complexity increases
Solution Approach 1:
The extending portion of the lead frame serves multiple functions simultaneously: it provides mechanical guidance during insertion, prevents short-circuits by maintaining proper spacing, and facilitates assembly alignment. By consolidating these multiple functions into a single structural element, the design improves reliability without proportionally increasing complexity, as the same structural feature accomplishes multiple protective and functional goals.
Data Source
AI summary
According to the embodiment, a semiconductor storage device includes an organic substrate, a semiconductor memory chip, a lead frame, and a resin mold section. The lead frame includes an adhering portion. The organic substrate is singulated to have a shape in which a portion in which the organic substrate does not overlap with the placing portion is larger than a portion in which the organic substrate overlaps with the placing portion, in plan view. The lead frame further includes a first extending portion in the adhering portion that extends to a surface different from a surface of the resin mold section on a side of an insertion direction.