Organic Substrate Warpage Correction via Calculated Layers
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Solution Overview
Problem
Warpage in organic substrates used in electronic packaging poses a significant challenge due to asymmetric mechanical properties, leading to device assembly issues and reduced yield, as substrates with excessive warpage are rejected.
Innovation Solution
A method involving the calculation and application of a correction layer with specific thickness, based on the coefficient of thermal expansion and Young's modulus of the core and buildup layers, to reduce warpage, using a system comprising warpage measurement, calculation, and correction layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate's warpage value does not meet the standards, then the substrate is rejected, but this lowers the yield and causes loss of production
Solution Approach 1:
The patent applies preliminary action by forming correction layers on the substrate before final assembly. The correction layers are deposited on specific regions (front surface, back surface, or both surfaces) to proactively compensate for warpage issues before the substrate would be rejected, thereby improving yield while maintaining warpage standards.
Solution Approach 2:
The patent implements local quality by applying correction layers selectively to specific regions of the substrate rather than uniformly across the entire surface. The correction layers can be applied to the front surface, back surface, or both surfaces depending on the warpage characteristics, allowing targeted correction of local warpage issues while minimizing material usage and processing complexity.
2Manufacturing precision
If correction layers are formed on both surfaces of the substrate, then warpage reduction effectiveness is improved, but process complexity and manufacturing cost increase
Solution Approach 1:
The patent applies dynamics by making the correction layer configuration adaptable rather than fixed. The correction layers can be applied to one surface or both surfaces depending on the specific warpage characteristics of each substrate, allowing the process to dynamically adjust to different warpage scenarios while maintaining effectiveness.
Solution Approach 2:
The patent implements parameter changes by varying the correction layer configuration (single-sided or double-sided application) based on warpage measurements. The thickness, material composition, and application surfaces are adjusted as parameters to optimize warpage correction while balancing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively minimizes warpage by applying correction layers on the organic substrate surfaces, improving yield and ensuring compliance with standards through precise thickness calculation and material selection.
Implementation Method 1
The causes for the initial warpage include asymmetric mechanical properties such as coefficients of thermal expansion and modulus of constituent materials
Data Source
AI summary
An organic substrate includes a core layer including organic materials; a first buildup layer on a top surface of the core layer; a second buildup layer on a bottom surface of the core layer; and at least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer, wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate.