Organic Through-Electrode Semiconductor Package for Thin High-Speed Routing
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Solution Overview
Problem
Existing semiconductor packages face challenges with high material costs, complex manufacturing processes, reliability issues due to thermal expansion mismatches, and increased size and thickness due to the use of silicon-based interposers and substrates, limiting miniaturization and integration.
Innovation Solution
A semiconductor package with a novel circuit board structure featuring a first insulating layer, conductive coupling parts, reinforcing parts, and through electrodes, utilizing prepreg and resin-coated copper layers to reduce thickness and improve reliability and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a silicon-based interposer is used to achieve high-speed signal transmission, then signal transmission speed is improved, but material cost and manufacturing complexity increase
Solution Approach 1:
The patent replaces the expensive silicon interposer with a cost-effective organic substrate that achieves the same functional purpose. The organic substrate serves as a temporary but effective medium for signal transmission between chips, eliminating the need for costly silicon-based interposers while maintaining high-speed signal transmission capabilities.
Solution Approach 2:
The patent creates an alternative structure that copies the functional benefits of the silicon interposer without using silicon material. The organic substrate with through-electrodes replicates the interposer's signal routing and electrical connection functions, providing a cheaper alternative that achieves identical performance outcomes.
2Speed
If a silicon-based interposer is used to achieve high-speed signal transmission, then signal transmission speed is improved, but material cost increases
Solution Approach 1:
The patent substitutes expensive silicon material with inexpensive organic substrate material. The organic substrate serves the same functional purpose as silicon interposer but at a fraction of the material cost, achieving high-speed signal transmission without the premium price tag of silicon-based solutions.
Solution Approach 2:
The patent changes the material parameter from silicon-based to organic-based substrate. This material substitution fundamentally alters the cost structure while maintaining the electrical and mechanical properties necessary for high-speed signal transmission, thereby reducing material cost without sacrificing performance.
3Speed
If a silicon-based interposer is used to achieve high-speed signal transmission, then signal transmission speed is improved, but package size increases
Solution Approach 1:
The patent merges the interposer function directly into the organic substrate, eliminating the need for a separate silicon interposer layer. This integration combines the substrate and interposer functions into a single unified structure, reducing the overall package thickness and size while maintaining high-speed signal transmission capabilities.
Solution Approach 2:
The patent transitions from a thick silicon-based interposer structure to a thin organic substrate structure. By changing the dimensional characteristics from bulky silicon to thin organic material, the patent achieves high-speed signal transmission in a more compact, thinner package form factor.
4Speed
If a silicon-based interconnect bridge is used to achieve high-speed signal transmission, then signal transmission speed is improved, but reliability deteriorates due to CTE mismatch
Solution Approach 1:
The patent uses an organic substrate that is homogeneous in material composition throughout its structure. This homogeneity eliminates the CTE mismatch problem that occurs at interfaces between different materials (silicon bridge and organic substrate), thereby improving reliability while maintaining high-speed signal transmission. The uniform organic material expands and contracts uniformly with temperature changes.
Solution Approach 2:
The patent employs composite material construction within the organic substrate, combining multiple layers and materials that are all compatible in terms of thermal expansion. The composite structure is designed so that all components have matched CTE characteristics, eliminating interfacial stress and reliability issues associated with mismatched materials.
5Speed
If a silicon-based interconnect bridge is used to achieve high-speed signal transmission, then signal transmission speed is improved, but power integrity characteristic deteriorates
Solution Approach 1:
The patent replaces the silicon interconnect bridge with an organic substrate structure that provides superior power integrity. The organic substrate with its distributed via structure and controlled impedance paths reduces signal loss and power degradation, delivering better power integrity characteristics than the silicon bridge alternative.
Data Source
AI summary
A semiconductor package according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer and including a first pad; a first molding layer disposed on an upper surface of the first insulating layer; a through electrode including a first conductive coupling part disposed on the first pad and having a first width and a through part disposed on the first conductive coupling part and having a second width smaller than the first width, and passing through of the first molding layer; and a second conductive coupling part disposed on the through part of the through electrode; wherein the first width of the first conductive coupling part is smaller than a third width of the second conductive coupling part.