Organic Underlayer Composition for Uniform Wafer Coating and Gap Fill
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Solution Overview
Problem
Existing organic underlayer films for semiconductor manufacturing face challenges in achieving uniform film formation, filling complex substrate forms without gaps, suppressing humps during the EBR process, and ensuring excellent coating properties while avoiding the use of perfluoroalkyl compounds due to environmental concerns.
Innovation Solution
A composition comprising a resin, a polymer with specific fluorine-containing structures, and a solvent is used to form an organic film, which includes a trifluoromethoxybenzene structure for improved surface active effects, enabling uniform film formation, gap-free filling, and hump suppression, while being environmentally friendly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional organic underlayer films are used, then coating properties may be adequate, but uniform film formation and gap-free filling on complex substrates cannot be achieved
Solution Approach 1:
The patent introduces specific fluorine-containing structures (trifluoromethoxybenzene, perfluoroalkyl groups) to modify the chemical and physical parameters of the organic underlayer film. These structural changes improve surface activity and wettability, enabling uniform film formation and gap-free filling on complex substrate geometries while maintaining coating properties
Solution Approach 2:
The patent employs composite polymer structures combining different fluorine-containing moieties (trifluoromethoxybenzene groups combined with perfluoroalkyl chains) within the same polymer molecule. This composite approach synergistically improves both film uniformity and filling properties by combining the benefits of different fluorine structures
2Reliability
If perfluoroalkyl compounds are used to improve surface active effects, then film-formability improves, but environmental harm increases
Solution Approach 1:
The patent extracts and removes the harmful perfluoroalkyl compound components from the system while retaining the beneficial film-forming properties by introducing alternative fluorine-containing structures (trifluoromethoxybenzene groups) that provide similar surface activity without the environmental persistence and toxicity issues of traditional perfluoroalkyl compounds
Solution Approach 2:
The patent converts the environmental harm associated with fluorinated compounds by selectively using fluorine structures that provide the necessary surface active effects for film formation while avoiding the specific perfluoroalkyl chain structures that cause environmental persistence and bioaccumulation, thus turning a potentially harmful class of compounds into an environmentally acceptable alternative
3Ease of manufacture
If spin-coating is used to form organic films, then film formation is simple, but humps occur during the EBR process
Solution Approach 1:
The patent modifies the chemical composition parameters of the organic underlayer by incorporating specific fluorine-containing structures that alter the film's rheological and surface properties. These parameter changes enable the film to maintain uniform thickness and suppress hump formation during spin-coating and subsequent EBR processes while keeping the manufacturing process simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent film-formability, in-plane uniformity, and filling properties, effectively suppressing humps during the EBR process, and is suitable for various patterning processes in semiconductor manufacturing, including multilayer resist processes, without using perfluoroalkyl compounds.
Implementation Method 1
a polymer (B) having a repeating unit represented by the following general formula (1) and/or (2)... having a suitable fluorine structure and a suitable polar structure... having both a hydrophilic group and a hydrophobic group introduced, and therefore, it is possible to impart the surface active effect necessary when forming an organic film
Data Source
AI summary
The present invention is a composition for forming an organic film, containing: a resin and/or compound (A) for forming an organic film; a polymer (B) having a repeating unit represented by the following general formula (1) and/or (2); and a solvent (C). This can provide: a composition for forming an organic film which is excellent in film-formability (in-plane uniformity) on a substrate (wafer) and filling property, can suppress humps in an EBR process, and allows an excellent process margin when used for an organic underlayer film for a multilayer resist; a method for forming an organic film, using the composition; a patterning process using the composition; a monomer; and a polymer.


