Organopolysiloxane Light-Diffusing Composition for Reflow-Durable Optics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a demand for light-diffusing materials with excellent light transmittance, light diffusivity, and mechanical properties, particularly those that are durable in reflow type soldering processes, and suitable for a wide range of optical members including encapsulants for light emitting devices.
Innovation Solution
A curable organopolysiloxane composition comprising organopolysiloxane with limited aryl groups, inorganic fillers, and specific organosilicon compounds, which can be cured to form a material with balanced light and mechanical properties, suitable for optical members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the amount of inorganic fillers is increased to improve light diffusivity, then light diffusivity is improved, but mechanical strength deteriorates
Solution Approach 1:
The patent uses a composite material system combining organopolysiloxane resin with 30-95 mass% inorganic fillers (such as silica, alumina, or titania particles). This composite structure allows the material to achieve both high light diffusivity through the inorganic filler distribution and adequate mechanical strength through the polymer matrix, resolving the contradiction between optical performance and mechanical properties.
2Illumination intensity
If aryl groups are increased to improve light transmittance, then light transmittance is improved, but heat resistance deteriorates
Solution Approach 1:
The patent precisely controls the aryl group content parameter within 0-10 mol% of the organic groups bonded to silicon atoms. By optimizing this compositional parameter, the invention achieves a balance where sufficient light transmittance is maintained while the overall thermal stability of the siloxane backbone is preserved, avoiding the heat resistance deterioration that would occur with higher aryl group content.
3Illumination intensity
If the composition is optimized for light diffusion, then light diffusivity is improved, but durability in soldering process deteriorates
Solution Approach 1:
The patent creates a composite material where inorganic fillers (30-95 mass%) provide light diffusion functionality while the organopolysiloxane matrix with controlled aryl group content (0-10 mol%) provides thermal stability for soldering process durability. The synergistic combination of these components resolves the contradiction between optical performance and processing reliability.
Solution Approach 2:
By optimizing the compositional parameters including inorganic filler content (30-95 mass%) and aryl group content (0-10 mol%), the invention achieves a formulation that simultaneously provides high light diffusivity and sufficient durability to withstand reflow soldering processes, eliminating the need to compromise between these competing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high light transmittance, diffusivity, and mechanical flexibility, making it suitable for optical members such as encapsulants for LEDs and organic light emitting devices, with reduced warping and deformation.
Implementation Method 1
an organopolysiloxane having at least two radical reactive groups and/or reactive groups that can be cross-linked by a hydrosilylation reaction in a molecule
Implementation Method 2
one or more types of inorganic fillers... exhibiting light diffusivity
Implementation Method 3
reactive groups that can be cross-linked by a hydrosilylation reaction
Data Source
AI summary
Provided herein is a light diffusing material having excellent light transmittance, light diffusivity, and mechanical properties. The light diffusing material comprises a curable organopolysiloxane composition, comprising: A) an organopolysiloxane having reactive groups; B) one or more inorganic fillers; and C) an organosilicon compound that differs from component A), and comprising component(s) C1) and/or C2). Component C1) is an organosilicon compound having a reactive functional group that can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and two or more silicon atoms, in the molecule. Component C2) is an organosilicon compound having a reactive functional group with three or more carbon atoms, which can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and one or more silicon atoms, in the molecule. The mass of component B) is 30 to 95% relative to the mass of the overall composition.