Curable Organopolysiloxane Composition for Optical Semiconductor Sealing
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Solution Overview
Problem
Existing curable organopolysiloxane compositions used for sealing and bonding optical semiconductor devices face issues with light absorption, scattering, yellowing over time, and decreased bonding strength, especially under high temperatures and long-term use.
Innovation Solution
A curable organopolysiloxane composition comprising specific ratios of alkenyl-containing and silicon-bonded hydrogen-containing organopolysiloxanes, along with a hydrosilylation-reaction catalyst, which forms a cured body with improved light transmittance, bondability, and low hardness, suitable for optical semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high hardness is achieved in cured body, then mechanical strength is improved, but the cured body becomes easily damaged during manufacture or use and can easily delaminate
Solution Approach 1:
The patent adjusts the molecular weight and compositional ratios of organopolysiloxane components (specifically the ratio of constituent (a) to constituent (b)) to optimize the balance between hardness and flexibility. By controlling the average molecular weight within specific ranges and adjusting the molar ratios of different siloxane units, the cured body achieves appropriate hardness while maintaining resistance to damage and delamination.
Solution Approach 2:
The patent creates a composite cured body by combining multiple organopolysiloxane constituents with different properties. The composition includes constituent (a) with specific siloxane units and constituent (b) with different siloxane units, forming a composite material that integrates the advantages of each component to achieve both mechanical strength and durability.
2Reliability
If long-time use at high temperatures is required, then reliability is improved, but the cured body is subject to yellowing which reduces light transmittance
Solution Approach 1:
The patent selects specific organopolysiloxane constituents with controlled compositional parameters that resist thermal degradation and yellowing. By adjusting the molecular structure and composition ratios within specified ranges, the cured body maintains both high-temperature stability and optical clarity over long periods.
3Strength
If bonding strength is improved, then reliability is improved, but the cured body may become too hard and brittle
Solution Approach 1:
The patent optimizes the average molecular weight and compositional ratios of the organopolysiloxane components to achieve adequate bonding strength while preventing excessive hardness and brittleness. By controlling the molar ratios of different siloxane units and the overall molecular weight distribution, the cured body attains balanced mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves long-lasting light transmittance and bondability, enhancing the reliability of optical semiconductor devices by maintaining mechanical strength and preventing yellowing, even under high temperatures and prolonged use.
Implementation Method 1
a curable organopolysiloxane composition comprising at least the following components: (A) an alkenyl-containing organopolysiloxane... (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms... (C) a hydrosilylation-reaction catalyst
Data Source
AI summary
A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.