Orientationless Transaction Card with Multi-Surface Contact Pads
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Solution Overview
Problem
Transaction cards, such as credit and debit cards, often require precise orientation when inserted into card readers, leading to failed payments if not aligned correctly, and they typically have a single contact pad for EMV chip communication, which can be inconvenient and vulnerable to theft.
Innovation Solution
A transaction card design featuring multiple contact pads on both surfaces, electrically connected through intermediate and middle layers to a single EMV chip, allowing for card insertion in any orientation and enhancing security by securing the chip within the card layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a single contact pad is used for EMV chip communication, then the card structure is simple, but the card requires precise orientation and is vulnerable to theft
Solution Approach 1:
The card is divided into multiple contact pads (first contact pad and second contact pad) positioned at different locations, allowing the card to be inserted in multiple orientations. Each contact pad connects to the same EMV chip through separate pathways, enabling independent operation and orientation flexibility.
Solution Approach 2:
The EMV chip serves multiple functions by being accessible through multiple contact pads, allowing the same chip to communicate with card readers in various orientations. This multi-functional design eliminates the need for precise orientation while maintaining a single chip architecture.
2Adaptability or versatility
If multiple contact pads are added to allow any orientation insertion, then ease of operation improves, but device complexity increases
Solution Approach 1:
The contact pads are embedded within the card's layered structure, with intermediate layers containing electrical traces that connect the contact pads to the EMV chip. This nested arrangement integrates the additional contact pads and connections into the existing card architecture without adding significant complexity.
Solution Approach 2:
The patent introduces vertical connectivity through intermediate layers (first intermediate layer, second intermediate layer, middle layer) to connect contact pads on different surfaces to the EMV chip. This three-dimensional arrangement enables multiple orientation access while maintaining a compact card structure.
3Reliability
If the EMV chip is secured within card layers, then security against theft improves, but manufacturing complexity increases
Solution Approach 1:
The EMV chip is embedded within the card's layered structure, positioned between the top layer and bottom layer with intermediate layers providing both structural support and electrical connections. This nested placement secures the chip within the card while maintaining accessibility through multiple contact pads.
Solution Approach 2:
The structural layers and electrical connection pathways are merged into a single integrated card structure. The intermediate layers simultaneously provide mechanical support, electrical tracing, and chip attachment, simplifying the manufacturing process while securing the chip effectively.
Data Source
AI summary
A transaction card is provided. The transaction card can include a top layer, a first intermediate layer, a middle layer, a second intermediate layer, and a bottom layer. Contact pads can be disposed in the top layer and bottom layer and can be electrically connected to each other via the first intermediate layer, the second intermediate layer, and the middle layer to provide an electrical connection to the same chip. At least one of the contact pads can be coupled to an integrated chip disposed between the top layer and the bottom layer.