Oriented Multilayer Capacitors for PCB Noise Reduction

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Solution Overview

Problem

Ceramic capacitors on printed circuit boards (PCBs) experience deformation due to the converse-piezoelectric effect, leading to undesirable audible noises, known as 'cap singing', which existing solutions have only moderately addressed, often at the cost of increased production costs and layout restrictions.

Innovation Solution

The use of both horizontal and vertical oriented multiple-layered capacitors on PCBs, where capacitors are charged and discharged simultaneously to counteract the deformation forces, reducing the overall impulse and noise by canceling out the vibrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If ceramic capacitors are used on PCBs, then compact size and high capacitance are achieved, but audible noise (cap singing) is generated due to deformation from converse-piezoelectric effect

Engineering Contradiction:
Improvecapacitor sizeVSAvoidaudible noise
Core Design Contradiction:
Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent combines multiple capacitive elements (ceramic capacitors and aluminum electrolytic capacitors) into a single hybrid capacitor assembly. The ceramic capacitors provide high capacitance in compact form while the aluminum electrolytic capacitors serve as a larger structural support that absorbs deformation forces, thereby reducing audible noise while maintaining electrical performance.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention uses a composite structure combining ceramic capacitor materials with aluminum electrolytic capacitor materials. This composite approach allows the small ceramic capacitors to function electrically while the larger aluminum electrolytic component provides mechanical stability and absorbs piezoelectric deformation, solving the noise problem without sacrificing capacitance density.

Inventive Principle:
Principle #40Composite materials

2Object-generated harmful factors

If capacitive elements are mounted on opposing sides of PCBs to reduce cap singing, then noise is reduced, but layout flexibility is restricted

Engineering Contradiction:
Improveaudible noiseVSAvoidlayout flexibility
Core Design Contradiction:
Object-generated harmful factorsVSAdaptability or versatility

Solution Approach 1:

By combining multiple capacitive elements into a single hybrid assembly that can be mounted on one side of the PCB, the invention eliminates the need for opposing-side mounting arrangements. This maintains layout flexibility while achieving noise reduction through the internal cancellation mechanism of the hybrid structure.

Inventive Principle:
Principle #5Merging (Combining)

3Object-generated harmful factors

If aluminum electrolytic capacitors are used to reduce noise, then cap singing is reduced, but capacitor size and cost increase

Engineering Contradiction:
Improveaudible noiseVSAvoidcapacitor size
Core Design Contradiction:
Object-generated harmful factorsVSVolume of moving object

Solution Approach 1:

The patent merges small ceramic capacitors (which are compact but noisy) with larger aluminum electrolytic capacitors (which are quiet but bulky). The resulting hybrid assembly achieves noise reduction while the overall size remains manageable because the ceramic capacitors contribute significant capacitance in a small footprint, offsetting the size of the aluminum electrolytic component.

Inventive Principle:
Principle #5Merging (Combining)

4Object-generated harmful factors

If multiple capacitive elements are combined to counteract deformation forces, then noise is reduced, but device complexity increases

Engineering Contradiction:
Improveaudible noiseVSAvoidcapacitor structure
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The invention merges multiple capacitive elements into a single integrated hybrid capacitor assembly that functions as one unified component. This approach reduces noise through internal force cancellation while presenting a simple, standardized component interface to the PCB, thereby minimizing increases in device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the deformation and noise caused by capacitive elements on PCBs, maintaining the capacitors' volume and reducing the audible noise associated with cap singing, while avoiding the geometric and cost limitations of previous solutions.

Implementation Method 1

ceramic capacitors can experience deformation that can lead to undesirable audible tones or noise called 'cap singing.' For example, ceramic capacitors vibrating from the converse-piezoelectric effect can cause the board to vibrate and produce an audible noise.

Methodology Applied
Scientific EffectConverse-piezoelectric effect: Converse Piezoelectric Effect

Implementation Method 2

The PCB can include a first horizontal orientated multiple-layered capacitor and a second vertical orientated multiple-layered capacitor. The capacitors are charged and discharged simultaneously to counteract the deformation forces, reducing the overall impulse and noise by canceling out the vibrations.

Methodology Applied
Scientific EffectVibration cancellation: Damping

Data Source

PatentUS7898818B2Variably orientated capacitive elements for printed circuit boards and method of manufacturing same
Publication Date: 2011.03.01 DELL PROD LP
  • US7898818B2 patent drawing
  • US7898818B2 patent drawing
  • US7898818B2 patent drawing

AI summary

Variably oriented capacitive elements for printed circuit boards (PCBs) and method of manufacturing the same. In one form the disclosure, a PCB can include a first multiple-layered capacitor including a first orientation and placed along a surface operable to mount electronic components. The PCB can also include a second multiple-layered capacitor including a second orientation different from the first. The second multiple-layered capacitor can be placed along the surface near the first multiple-layered capacitor.