Oriented Nanofiber Thermal Interface Material
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Solution Overview
Problem
Conventional adhesives used to attach heat sinks to heat sources have low thermal conductivities, hindering efficient heat transfer from heat sources to heat sinks, which can lead to system overheating and reliability issues in manufacturing, automotive, and microelectronics applications.
Innovation Solution
A nanofiber layer with oriented nanofibers is placed between a heat sink and a heat source, with an adhesive layer in between, and the adhesive is heated to reduce its thickness, increasing the thermal conductivity of the adhesive and nanofiber layer, facilitating better heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesives are used to attach heat sink to heat source, then the adhesive provides bonding strength, but the thermal conductivity is low which hinders heat transfer
Solution Approach 1:
The patent uses a composite structure consisting of nanofibers embedded in an adhesive layer. The nanofibers (such as carbon nanotubes or graphene) provide high thermal conductivity pathways, while the adhesive matrix provides bonding. This composite material combines the advantages of both materials to achieve simultaneous bonding strength and high thermal conductivity.
Solution Approach 2:
The nanofiber network acts as an intermediary thermal conduction pathway between the heat source and heat sink. Instead of relying solely on the adhesive for heat transfer, the nanofibers serve as intermediate conductors that efficiently bridge the thermal gap while the adhesive provides the bonding function.
2Loss of energy
If adhesive layer thickness is reduced to improve thermal conductivity, then heat transfer efficiency increases, but the adhesive may lose bonding strength
Solution Approach 1:
By incorporating nanofibers into the adhesive layer, the composite structure maintains bonding strength even at reduced thickness. The nanofibers provide mechanical reinforcement and create a three-dimensional network that distributes stress, compensating for the reduced adhesive thickness while simultaneously improving thermal conductivity.
Solution Approach 2:
The nanofibers are distributed throughout the adhesive layer to create localized high-conductivity pathways. This local enhancement of thermal conductivity properties allows the adhesive layer to be thinner overall while maintaining sufficient heat transfer capability and bonding strength through the strategically placed conductive elements.
3Loss of energy
If nanofiber layer is added to improve thermal conductivity, then heat transfer efficiency increases, but the device structure becomes more complex
Solution Approach 1:
The patent merges the adhesive layer and nanofiber layer into a single integrated thermal interface material. The nanofibers are embedded within the adhesive matrix, combining the bonding function of the adhesive with the thermal conduction function of the nanofibers in one unified structure, thereby reducing overall device complexity despite the enhanced functionality.
Solution Approach 2:
The adhesive-nanofiber composite layer serves multiple functions simultaneously: it provides bonding between the heat sink and heat source, conducts heat efficiently through the nanofiber pathways, and maintains structural integrity. This multi-functionality eliminates the need for separate adhesive and thermal interface layers, simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances thermal conductivity by up to 30% and allows for conformal adhesion to surfaces with features as small as 0.5 microns, improving heat removal efficiency and system reliability.
Implementation Method 1
heating the adhesive layer, the heating reducing a thickness of the adhesive layer from a first thickness to a second thickness less than the first thickness
Implementation Method 2
a nanofiber layer that interacts with thermal radiation so as to form a nanofiber thermal interface material
Implementation Method 3
Conduction from a heat source to a heat sink generally requires intimate contact between surfaces
Implementation Method 4
heating the adhesive layer, the heating reducing a thickness of the adhesive layer
Data Source
AI summary
A nanofiber structure is described that is composed of a substrate and a layer of oriented nanofibers. Nanofibers of the layer can be oriented in a common direction. An angle of the common direction can be selected so that nanofibers of the sheet are oriented at an angle with respect to an underlying substrate even if the underlying substrate is not planar. The angle can be used to adapt the sheets to demands as a thermal interface material.