Orifice Slot Cooling Matrix for Electronics Heat Dissipation
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Solution Overview
Problem
The challenge lies in efficiently delivering and returning cooling fluid to extremely small electronic components, such as those on the order of one millimeter by one millimeter, while managing pressure losses and flow characteristics effectively, as traditional heat dissipation methods like heat fins become inadequate with increasing heat generation.
Innovation Solution
A compact cooling package is designed with a supply port, supply plenum, return port, and return plenum, incorporating an impingement channel layer, an orifice layer, and a slot layer, which provide a network of small channels and orifices to deliver and return cooling fluid efficiently, with varying densities and dimensions to match heat-generating areas, ensuring uniform pressure and fluid distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional heat fins are used for heat dissipation, then the structure is simple and easy to manufacture, but the heat dissipation efficiency becomes inadequate for small electronic components with increasing heat generation
Solution Approach 1:
The cooling system is divided into multiple functional layers including a distribution layer with flow distribution features, a heat dissipation layer with heat dissipation features, and a substrate. This segmentation allows each layer to perform its specific function optimally while maintaining manufacturability through standard PCB fabrication processes.
Solution Approach 2:
The invention transitions from traditional three-dimensional heat fins to a planar two-dimensional cooling structure integrated into the PCB substrate. The cooling fluid flows through channels in the distribution layer and transfers heat to heat dissipation features in the heat dissipation layer, achieving effective heat dissipation in a flat configuration suitable for modern electronics.
2Productivity
If cooling fluid passages are made extremely small to match component size, then cooling efficiency improves, but pressure losses increase and flow control becomes challenging
Solution Approach 1:
The distribution layer incorporates flow distribution features with varying geometries at different locations to optimize fluid flow characteristics. The heat dissipation layer contains heat dissipation features with different sizes and configurations matched to specific heat-generating areas, allowing local optimization of cooling performance while managing pressure losses through gradual transitions.
3Volume of moving object
If the cooling package is made compact to match small component sizes, then space utilization improves, but manufacturing precision requirements increase
Solution Approach 1:
The distribution layer serves multiple functions: it distributes cooling fluid to various locations, provides structural support for the heat dissipation layer, and incorporates flow distribution features that optimize fluid flow. The heat dissipation layer similarly provides both thermal management and structural functions, reducing the need for additional components and simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient cooling of small electronic components by providing uniform pressure and varying fluid volumes to distinct heat-generating areas, effectively managing heat dissipation in a compact and reliable manner.
Implementation Method 1
The cooling fluid may then be directed into channels in the heat dissipation layer to absorb heat from the heated area
Implementation Method 2
The cooling fluid may then be directed into channels in the heat dissipation layer to absorb heat from the heated area
Data Source
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AI summary
A cooling supply package for an electronic component 22 has a supply port 17 communicating with a plurality of outer supply channels, and a return port 19 communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer 34 supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.