Ortho-Substituted Resin Composition for Low Water Absorption
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Solution Overview
Problem
Existing photosensitive resin compositions for semiconductor and organic EL display applications face challenges with high water absorption rates due to residual polar groups, leading to poor sensitivity and reliability in high humidity environments.
Innovation Solution
A resin composition incorporating an alkali-soluble resin and an amido-phenol compound with a phenolic hydroxyl group or an aromatic amido acid compound, where the phenolic hydroxyl or carboxy groups are positioned at the ortho position, facilitating high sensitivity and low water absorption by eliminating residual polar groups during curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a positive photosensitive resin composition incorporating an alkali-soluble resin, a diazonaphthoquinone compound, and a phenolic hydroxyl group-free and methylol group-containing compound is used, then a cured film with low water absorptivity can be produced, but the sensitivity is poor
Solution Approach 1:
The patent changes the chemical structure parameters of the phenolic compound by introducing specific ortho-substituted groups (formula 1 or 2) that enable both high sensitivity and low water absorption. The substitution pattern and molecular weight parameters are optimized to achieve the desired balance between sensitivity and water resistance.
Solution Approach 2:
The patent creates a composite resin system combining alkali-soluble resin with specifically designed ortho-substituted phenolic compounds. This composite approach allows the phenolic compound to serve dual functions: enhancing sensitivity through ortho-position interactions and reducing water absorption through proper molecular design with appropriate substituent groups.
2Productivity
If a positive photosensitive resin composition containing an alkali-soluble resin, a photosensitive diazoquinone compound, and a phenol compound is used, then high sensitivity and high resolution are achieved, but the phenolic hydroxyl group remains in the cured film leading to high water absorption rate
Solution Approach 1:
The patent extracts or eliminates the problematic free phenolic hydroxyl group from the final cured film structure by using ortho-substituted phenolic compounds where the hydroxyl group is blocked by adjacent substituents. This prevents the hydroxyl group from remaining as a free polar group that would increase water absorption.
Solution Approach 2:
Instead of using conventional phenolic compounds with free hydroxyl groups that provide sensitivity but cause water absorption, the patent inverts the approach by using ortho-substituted phenolic compounds where the substitution pattern itself enables both sensitivity and water resistance, turning the usual problem into a solution.
3Productivity
If conventional photosensitive resin compositions are used to achieve high sensitivity patterning, then shortened exposure periods are realized, but the cured film exhibits high water absorption rate due to residual polar groups
Solution Approach 1:
The patent changes the chemical parameters of the resin composition by incorporating ortho-substituted phenolic compounds with specific molecular structures (formulas 1 and 2). These structural parameter changes allow the material to achieve both high photosensitivity for short exposure times and low water absorption by eliminating residual polar hydroxyl groups through the ortho-substitution design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high sensitivity and low water absorption rates in cured films, enhancing reliability in high humidity environments and improving patterning capabilities for semiconductor and organic EL display applications.
Implementation Method 1
facilitating high sensitivity and low water absorption by eliminating residual polar groups during curing
Implementation Method 2
an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position
Data Source
AI summary
The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position:wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO)n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO)n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.