Orthodontic Bracket Removal Using Actinic Radiation
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Solution Overview
Problem
Current orthodontic treatment methods are time-intensive, costly, and uncomfortable for patients due to the need for acid etching and mechanical debonding of orthodontic devices, which can cause enamel damage and allergic reactions, and require significant skill to avoid patient discomfort.
Innovation Solution
A device with a light source emitting incoherent actinic radiation, such as IR, NIR, and UV spectra, combined with sonic or ultrasonic vibrations, to weaken the adhesive bond between orthodontic appliances and teeth, allowing for easier and pain-free debonding without mechanical force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If acid etching is used to prepare tooth enamel for orthodontic device attachment, then the adhesive bond strength is improved, but the tooth enamel is damaged and the process becomes time-intensive
Solution Approach 1:
The patent removes the acid etching step from the orthodontic device attachment process. Instead of using phosphoric acid to demineralize and etch the enamel surface, the invention applies adhesive directly to the cleaned tooth surface, allowing the adhesive to form its own bonding interface without requiring enamel modification. This extraction of the harmful etching step eliminates enamel damage while maintaining bonding capability.
Solution Approach 2:
The patent replaces the chemical etching mechanism with a direct adhesive bonding mechanism. Rather than using acid to create a porous structure for mechanical interlock, the invention relies on the adhesive's chemical bonding properties to attach directly to the intact enamel surface, substituting a harmful chemical process with a safer alternative.
2Ease of operation
If mechanical force is applied to debond orthodontic brackets from teeth, then the bracket is removed, but the patient experiences discomfort and pain
Solution Approach 1:
The patent applies actinic radiation to the adhesive bond before the debonding process begins. This preliminary action weakens or reverses the adhesive bonding, preparing the interface for easy separation. By pre-treating the bond with light exposure, the subsequent removal requires minimal mechanical force and causes no patient discomfort.
Solution Approach 2:
The patent replaces the mechanical debonding process with a photochemical debonding process. Instead of using pliers to apply shear forces that mechanically fracture the bond, the invention uses actinic radiation to chemically alter the adhesive, causing it to weaken or reverse its bonding. This substitution eliminates the need for forceful mechanical removal and associated patient pain.
3Reliability
If conventional bonding procedures are followed, then orthodontic devices are securely attached, but the chair time and treatment cost increase
Solution Approach 1:
The patent extracts multiple time-consuming steps from the conventional bonding procedure. By removing acid etching, extended drying periods, and complex preparation sequences, the invention reduces the overall process time while maintaining secure attachment through direct adhesive application and UV curing.
Solution Approach 2:
The patent skips intermediate preparation steps that traditionally require extended time. Instead of following the sequential process of cleaning, etching, rinsing, drying, and sealing, the invention moves directly from surface cleaning to adhesive application and immediate UV curing, rushing through the essential bonding actions without unnecessary delays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device reduces the bond strength of adhesives, enabling pain-free and efficient removal of orthodontic appliances, minimizing enamel damage and allergic reactions, while reducing chair time and improving the ease of orthodontic procedures for both clinicians and patients.
Implementation Method 1
A device with a light source emitting incoherent actinic radiation, such as IR, NIR, and UV spectra, combined with sonic or ultrasonic vibrations, to weaken the adhesive bond between orthodontic appliances and teeth
Implementation Method 2
A device with a light source emitting incoherent actinic radiation, such as IR, NIR, and UV spectra, combined with sonic or ultrasonic vibrations, to weaken the adhesive bond between orthodontic appliances and teeth
Data Source
Figure 1~2
Figure 3A~4
Figure 3B
AI summary
A device (100, 200, 300) for use by a clinician includes a tip structure (106, 130, 140, 160, 180, 206, 400, 500, 600, 700) that is configured to extend from a handle (104) and to be inserted into a patient's mouth and at least one light source (120, 210, 312, 406, 708) that is capable of emitting incoherent actinic radiation from the device (100, 200, 300). The light source (120, 210, 312, 406, 708) is on the tip structure (106, 130, 140, 160, 180, 206, 400, 500, 600, 700) or within the handle (104). A light device (100, 200, 300) includes a shell (302, 402, 502) that is configured to engage an orthodontic bracket (12) while the orthodontic bracket (12) is attached to a tooth (14) and at least one light source (120, 210, 312, 406, 708) is embedded in the shell (302, 402, 502) and is capable of emitting incoherent actinic radiation. A method of debonding an orthodontic appliance (12) from a tooth (14) includes exposing an adhesive (10) secured to the tooth (14) to incoherent actinic radiation that reduces a bond strength of at least a portion of the adhesive (10) and separating the orthodontic appliance (12) from the tooth (14) at the portion of the adhesive (10) having reduced bond strength.