Adaptor for Orthogonal Backplane Connectors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing backplane connector designs face challenges in maintaining high data rates, particularly with mid-plane configurations, which can lead to issues as data rates increase, necessitating an improved connector system for efficient signal transmission and ground terminal commoning.
Innovation Solution
An adaptor with recesses for orthogonal connectors, featuring a pin array with signal and ground terminals arranged in differential pairs and a commoning mechanism for ground terminals, allowing for efficient signal transmission and reduced cross-talk, while enabling flexible configurations for high data rates exceeding 15 Gbps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing mid-plane connector designs are used, then connector configuration flexibility is provided, but electrical performance deteriorates at high data rates
Solution Approach 1:
The patent introduces an adaptor as an intermediary component between two orthogonal connectors. This adaptor contains a pin array with signal terminals and ground terminals arranged in a specific configuration, serving as a mediator to transition signals between orthogonal orientations while maintaining high data rate performance through controlled impedance and proper grounding
Solution Approach 2:
The patent transitions from a single-plane connector configuration to a three-dimensional adaptor structure that accommodates orthogonal connectors. The pin array extends in two directions from the floor of the adaptor, enabling spatial transformation of signal paths from one orthogonal orientation to another, thus solving the configuration flexibility issue while maintaining electrical performance
2Productivity
If dense pin fields are used to increase data rates, then transmission capacity improves, but signal integrity deteriorates due to increased cross-talk
Solution Approach 1:
The patent applies local quality by providing enhanced grounding specifically at critical locations within the pin array. Ground terminals are strategically positioned adjacent to signal terminals, and the floor of the adaptor provides a common ground plane. This localized grounding approach reduces cross-talk between adjacent signal pairs while maintaining the dense pin field configuration necessary for high data rates
Solution Approach 2:
The patent creates equipotential regions through the common ground plane formed by the floor of the adaptor and the interconnected ground terminals. This equipotential grounding structure provides a stable reference potential across the entire pin array, reducing ground loops and potential differences that could cause signal integrity issues in dense high-speed configurations
Data Source
AI summary
A connector system includes a first housing, a second housing and a third housing. The first and second housings each include a wafer with signal terminals aligned in corresponding rows. The third housing mates to the first and second housings and supports a terminal array that connects the signal terminals in the first housings to the signal terminals in the second housing when the first and second wafer are arranged perpendicular to each other.