Orthogonal Circuit Board Interconnect via Cam Plate Mechanism

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Solution Overview

Problem

High-performance computer systems face challenges in achieving efficient electrical interconnections and signal quality due to traditional copper circuit trace paths, which limit data rates and flexibility in network design.

Innovation Solution

The implementation of an orthogonal circuit board connection system using a midplane with connectors that are press-fit into common via holes, eliminating traditional copper circuit paths and utilizing a cam plate mechanism for secure connection, allowing for direct and short signal pathways.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional copper circuit trace paths are used for interconnection, then system architecture is simplified, but signal quality deteriorates and data rates are limited

Engineering Contradiction:
Improvesignal qualityVSAvoidinterconnection architecture
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the traditional copper circuit trace paths from the midplane, removing the source of signal distribution problems. By taking out the harmful intermediate distribution layer, signals are directly coupled between connectors through short pathways, improving signal quality while accepting increased structural complexity in the connector assembly mechanism

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from planar copper trace interconnections to three-dimensional direct connector coupling. Connectors are positioned to mate directly across the midplane thickness, creating vertical signal pathways that eliminate the horizontal trace distribution layer, thereby improving signal integrity at the cost of more complex connector positioning requirements

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If connectors are press-fit into common via holes, then signal path length is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedata rateVSAvoidconnector alignment
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent incorporates preliminary alignment features such as positioning pins and guide structures that pre-align connectors before the press-fit operation. This preliminary positioning action ensures that connectors are correctly oriented and spaced, reducing the actual precision required during the high-speed press-fit insertion process while achieving the short signal path goal

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent employs compliant elements and tolerance-compensating structures that absorb manufacturing variations before they affect connector alignment. These cushioning features accommodate small deviations in via hole positioning or connector dimensions, maintaining reliable electrical contact despite increased precision demands from the direct-coupling approach

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If midplane circuit traces are eliminated, then signal quality improves, but connector assembly complexity increases

Engineering Contradiction:
Improveelectrical signal qualityVSAvoidconnector assembly mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the connector assembly into modular components including separate positioning elements, connector bodies, and latching mechanisms. This segmentation allows each component to be optimized independently and assembled in a systematic manner, reducing the overall assembly complexity despite eliminating the simplifying midplane traces

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediary structures such as positioning pins, guide rails, and alignment features that mediate between the connectors and the midplane. These intermediaries facilitate precise connector placement and assembly without requiring complex direct coupling mechanisms, managing the increased assembly complexity while maintaining signal quality benefits

Inventive Principle:
Principle #24Intermediary (Mediator)

4Reliability

If a cam plate mechanism is used for connection, then connection reliability is improved, but device complexity increases

Engineering Contradiction:
Improveconnection stabilityVSAvoidlatch mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a dynamic cam plate mechanism that transitions from an open to a closed latched position, providing progressive engagement and alignment during the connection process. This dynamic action ensures reliable connector mating through controlled movement and force application, justifying the increased mechanical complexity by achieving superior connection stability and signal integrity

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS8944832B1Apparatus to interconnect orthogonal circuit boards for high data rate use
Publication Date: 2015.02.03 LENOVO INT LTD
  • US8944832B1 patent drawing
  • US8944832B1 patent drawing
  • US8944832B1 patent drawing

AI summary

A method includes securing a midplane in a chassis, wherein the midplane has one or more connectors, and securing a circuit board in a module, wherein the circuit board has one or more connectors secured along a leading edge of the circuit board for selectively connecting with the one or more connector on the midplane. The method further includes positioning the module so that the circuit board within the module is orthogonal to the midplane, and manually actuating a handle from an unlatched position to a latched position to rotate a cam plate and cause a cam surface of the cam plate to pull the circuit board toward the midplane and connect the one or more connector on the circuit board with the one or more connector on the midplane.