Orthogonal Connection Board Positioning for Circuit Board Cooling
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Solution Overview
Problem
The existing cooling mechanisms for circuit boards, particularly with orthogonal connection boards, restrict airflow and fail to provide sufficient cooling, especially as heat generation increases due to downsized and high-performance configurations.
Innovation Solution
A cooling mechanism that includes multiple circuit boards arranged in parallel with fans generating airflow along these boards and a connection board positioned orthogonally and separately, ensuring unobstructed airflow paths to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connection board is arranged orthogonally to the cooling wind flow path, then the connection board can couple circuit boards effectively, but the connection board closes the flow path and prevents sufficient cooling of the circuit board
Solution Approach 1:
The connection board is positioned at a location separated from the main cooling wind flow path, utilizing a different spatial dimension. The flow path extends along the circuit boards without being blocked by the orthogonally arranged connection board, allowing cooling wind to reach the circuit boards effectively while the connection board performs its coupling function.
2Temperature
If a wind opening is provided at the connection board, then some cooling wind can pass through, but the flow rate is restricted and cooling of the circuit board is still insufficient
Solution Approach 1:
The connection board is extracted from the main cooling wind flow path and positioned at a separated location. This removes the obstruction caused by the connection board to the cooling airflow, allowing the cooling wind to flow freely along the circuit boards without needing wind openings in the connection board, thereby avoiding flow rate restrictions.
3Productivity
If circuit boards are downsized and configured with high-performance parts, then device density and performance increase, but heat generating amount increases and sufficient cooling becomes more difficult
Solution Approach 1:
The cooling wind flow path is arranged to extend along the circuit boards in a direction that bypasses the orthogonally positioned connection board. This spatial arrangement ensures that even with downsized, high-performance circuit boards generating more heat, the cooling wind can effectively reach all circuit boards without being blocked, providing sufficient cooling for the increased heat generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases cooling efficiency for circuit boards by maintaining airflow paths and reducing fan requirements, leading to improved heat management and cost reduction.
Implementation Method 1
one or more first fans for generating a cooling wind in a first flow path formed along the plurality of first circuit boards
Data Source
AI summary
A cooling mechanism includes a plurality of first circuit boards arranged in parallel with each other, one or more first fans for generating a cooling wind in a first flow path formed along the plurality of first circuit boards, and a connection board arranged orthogonally to the first flow path and at a position different from a position of the first flow path, and coupling the plurality of first circuit boards.