Direct Connect Orthogonal Connector Impedance Control
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Solution Overview
Problem
Direct connect orthogonal electrical connectors face challenges in maintaining signal integrity due to close proximity of conductors, electrical interference, and lack of mechanical support, which affects impedance uniformity and alignment precision.
Innovation Solution
The use of a conductive member with uniform signal-to-ground spacing and additional mating beams to ensure reliable connections and reduce noise, reflections, and impedance discontinuities, while allowing for flexible alignment and compact connector design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conductors are placed in close proximity to achieve high density connections, then connection density is improved, but electrical interference between adjacent signal conductors increases
Solution Approach 1:
Ground conductors are introduced as intermediary elements positioned between adjacent signal conductors. These ground conductors act as shields that block electrical interference between signal paths while maintaining compact conductor spacing for high density connections.
Solution Approach 2:
The connector structure alternates between signal conductors and ground conductors, creating localized regions where ground conductors provide shielding specifically where electrical interference occurs between adjacent signal paths, while signal conductors maintain close spacing for high density.
2Reliability
If ground conductors are added to reduce interference, then electrical properties are improved, but impedance uniformity becomes difficult to maintain
Solution Approach 1:
The spacing between signal conductors and ground conductors is carefully controlled and standardized throughout the connector structure. By maintaining consistent parameters for conductor spacing and geometry, uniform impedance is achieved across all signal paths despite the presence of multiple ground conductors for interference reduction.
3Measurement precision
If a rigid support structure like midplane is used to provide mechanical alignment, then alignment precision is improved, but device complexity and cost increase
Solution Approach 1:
The connector structure incorporates self-aligning features where guide pins on one connector automatically align with corresponding holes in the mating connector. This self-service alignment mechanism eliminates the need for complex rigid support structures like midplanes, reducing overall device complexity while maintaining precise alignment.
4Measurement precision
If guide pins are used to guide alignment, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The alignment function is segmented into simple, discrete guide pins and corresponding holes rather than requiring a complex integrated support structure. This segmentation allows alignment to be achieved through minimal, simple components that reduce overall device complexity while maintaining precision.
Data Source
AI summary
A direct-connect orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings through which signal conductors of the first and second components may connect. As such, signal conductors may be positioned relative to the conductive member such that a uniform impedance is maintained along a signal path throughout the interconnection, reducing noise and reflections. The signal conductors may be formed with multiple beams of different lengths to create multiple points of contact distributed along an elongated dimension. For example, a third beam may be fused to a mating portion to allow a tolerance for deviations in alignment between two directly connected connectors.