Orthogonal Heat Spreader for IC Chip Thermal Management
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Solution Overview
Problem
As electronic devices shrink in size but increase in computing power, they require more efficient heat removal to manage high power consumption, which existing technologies struggle to address effectively.
Innovation Solution
The integration of a stiffening frame with a central opening for a semiconductor chip, combined with first and second directional heat spreaders that transfer heat in opposing bivector directions, enhances heat dissipation by providing a more efficient thermal path from the chip to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are shrunk in size to reduce form factor, then device portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat spreader is divided into multiple segments with different thermal conductivities arranged in a gradient pattern. High thermal conductivity materials are positioned closer to the heat source while lower conductivity materials are positioned farther away, creating an optimized thermal management system that efficiently dissipates heat from compact high-power devices without requiring increased device volume.
Solution Approach 2:
Different regions of the heat spreader are assigned different thermal properties tailored to local heat flux requirements. The heat spreader features zones with varying thermal conductivities that match the local heat generation and dissipation needs, allowing efficient heat removal from hot spots while maintaining overall compact device dimensions.
2Productivity
If more computing devices are packaged in a smaller area to increase computing power, then device productivity is improved, but heat generation increases
Solution Approach 1:
The heat spreader is divided into multiple segments with different thermal conductivities arranged in a gradient pattern. High thermal conductivity materials are positioned closer to the heat source while lower conductivity materials are positioned farther away, creating an optimized thermal management system that efficiently dissipates heat from compact high-power devices without requiring increased device volume.
Solution Approach 2:
The heat spreader employs a composite structure combining materials with different thermal conductivities in a gradient arrangement. This composite design allows the system to handle high heat fluxes from densely packed computing devices by directing heat flow through optimal material pathways, enabling high computing power density while managing the resulting heat generation effectively.
3Device complexity
If traditional heat removal methods are used in compact devices, then device simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat spreader is divided into multiple segments with different thermal conductivities arranged in a gradient pattern. High thermal conductivity materials are positioned closer to the heat source while lower conductivity materials are positioned farther away, creating an optimized thermal management system that efficiently dissipates heat from compact high-power devices without requiring increased device volume.
Solution Approach 2:
The thermal conductivity parameter of the heat spreader is varied spatially to optimize heat dissipation. By changing the thermal conductivity parameter across different regions of the heat spreader, the system achieves superior heat dissipation efficiency compared to uniform material designs, while maintaining a relatively simple overall structure that integrates into compact devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved heat removal from the semiconductor chip, distributing heat evenly across the module and enhancing the efficiency of heat dissipation compared to traditional methods, thereby addressing the challenge of increased heat generation in compact electronic devices.
Implementation Method 1
The first directional heat spreader is arranged to transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls
Implementation Method 2
The second directional heat spreader arranged to transfer heat from the first directional heat spreader in a second opposing bivector direction towards the second pair of opposing sidewalls
Data Source
AI summary
An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader. The second directional heat spreader transfers heat from the first directional heat spreader towards the second pair of opposing sidewalls.