Orthogonal Inductor Heat Sink Assembly for Dense Power Converters
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Solution Overview
Problem
Conventional power modules have limited volume utilization, low inductance, and poor cooling performance, which restricts the density of circuitry and efficiency in energy conversion, particularly in power converter circuits.
Innovation Solution
The implementation of a heat sink assembly with electrically conductive and magnetic permeable materials, where elements are bent to extend orthogonally from the heat sink, creating voids for increased inductance and cooling, and are integrated with power converter circuitry to enhance heat dissipation and magnetic flux containment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional planar circuit board implementation is used, then ease of manufacture is maintained, but volume utilization is limited and inductance is low
Solution Approach 1:
The patent transitions from planar 2D circuit board layout to 3D vertical stacking architecture. Multiple circuit boards are stacked vertically with conductive vias penetrating through insulating layers to establish electrical connections between layers, thereby utilizing the third dimension (height) to increase volume utilization and inductance without compromising manufacturability
Solution Approach 2:
The patent implements nested structure where conductive vias are embedded within insulating layers, and multiple circuit boards are stacked within a compact housing. The inner circuit boards are nested within the outer structure, with vias penetrating through multiple layers to create compact nested arrangements that maximize space utilization
2Temperature
If conventional power module design is used, then device complexity is low, but cooling performance is poor
Solution Approach 1:
The patent merges the inductor structure with the heat sink into a single integrated component. The inductor windings are formed using conductive material that is directly coupled to or forms part of the heat sink structure, allowing simultaneous heat dissipation and inductance function within one component, thereby improving cooling performance without proportionally increasing overall device complexity
Solution Approach 2:
The conductive material serving as inductor windings also serves as a heat conduction path to the heat sink. This multi-functional design allows the same structural element to provide both electrical inductance and thermal management functions, improving cooling performance while minimizing additional complexity
3Quantity of substance
If conventional power module design is used, then device complexity is low, but inductance is low
Solution Approach 1:
The patent increases inductance by extending conductor paths in the vertical dimension through multiple stacked layers. Conductive vias penetrate through insulating layers to create three-dimensional current paths, significantly increasing the effective length and complexity of the magnetic flux path, thereby increasing inductance without merely expanding planar area
Solution Approach 2:
The patent employs composite structure combining conductive materials (for inductor windings and vias) with insulating materials (for separation and support layers). This composite arrangement allows creation of complex multi-layer inductor structures with optimized magnetic properties while maintaining electrical isolation between different conductive paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for higher density circuitry and improved cooling performance, maximizing inductance and reducing DC resistance, thereby enhancing the efficiency of energy conversion and reducing environmental impact.
Implementation Method 1
a heat sink element fabricated from electrically conductive material
Implementation Method 2
magnetic permeable material including: i) a first void extending between a first surface of the magnetic permeable material and a second surface of the magnetic permeable material
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3C
AI summary
An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.