Orthogonal Interconnection System for Signal Integrity

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Solution Overview

Problem

The existing orthogonal interconnection systems in communications technologies face challenges in upgrading due to increased link length, signal loss, and heat dissipation issues, particularly with high-speed signals, and are costly to upgrade.

Innovation Solution

A perpendicular and orthogonal interconnection system is introduced, featuring a center backplane with right angle male and female connectors directly connected in one-to-one correspondence, allowing for easy replacement of boards to shorten signal links and improve heat dissipation without the need for an orthogonal backplane, reducing upgrade costs and enhancing signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional orthogonal connectors are used with a center backplane, then interconnection between boards is achieved, but the link length increases causing signal loss

Engineering Contradiction:
Improvesignal qualityVSAvoidlink length
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent transitions from a conventional planar connector arrangement to a three-dimensional orthogonal structure. Male connectors extend perpendicular from the backplane surface, allowing female connectors on adjacent boards to mate directly with them. This spatial reconfiguration eliminates the need for signals to traverse through the backplane thickness, dramatically shortening the electrical path length while maintaining reliable interconnection.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the backplane size increases to accommodate more slots, then system capacity grows, but heat dissipation becomes a bottleneck

Engineering Contradiction:
Improvesystem capacityVSAvoidheat dissipation
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent segments the monolithic backplane into multiple modular units, each handling specific board connections. This segmentation allows for distributed heat management where each module can be independently cooled. The orthogonal connector design further divides the thermal path by allowing heat to dissipate from multiple surfaces (top and bottom of boards) rather than relying solely on conduction through the entire backplane thickness.

Inventive Principle:
Principle #1Segmentation

3Temperature

If improved orthogonal connectors are used with a via hole in the backplane, then heat dissipation is facilitated, but the link length is still not sufficiently shortened

Engineering Contradiction:
Improveheat dissipationVSAvoidlink length
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

The patent extracts the critical signal transmission function from the backplane substrate itself. By using orthogonal male connectors that extend perpendicularly from the backplane surface, the signal path is separated from the backplane's internal via holes and ground structures. This extraction allows the backplane to focus on mechanical support and power distribution, while the connectors handle high-speed signal transmission with minimal path length, effectively removing the backplane's signal routing limitations.

Inventive Principle:
Principle #2Taking out (Extraction)

4Reliability

If the existing orthogonal architecture is upgraded, then performance improves, but upgrade costs are high

Engineering Contradiction:
Improvesignal qualityVSAvoidupgrade cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent designs a universal orthogonal connector system where male and female connectors follow standardized geometries and mating interfaces. This universality allows the same connector types to be used across different board types and backplane configurations, enabling incremental upgrades where individual components can be replaced or upgraded independently without requiring complete system redesign. The modular approach reduces upgrade costs by allowing selective replacement of only the necessary components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10084255B2Perpendicular and orthogonal interconnection system and communications device
Publication Date: 2018.09.25 HUAWEI TECH CO LTD
  • US10084255B2 patent drawing
  • US10084255B2 patent drawing
  • US10084255B2 patent drawing

AI summary

An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Right angle male connectors re arranged on each of the first boards and right angle female connectors are arranged on each of the second boards. The right angle male connectors and the right angle female connectors directly cooperate and are connected in one-to-one correspondence.