Orthogonal Microstructure Assembly with Conductive Blades
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Solution Overview
Problem
Current technologies face challenges in achieving multi-contact connections, particularly in-plane to off-plane connections, and assembling modular probe arrays for neural sensing and actuation, which limits the complexity and functionality of 3D probe arrays and increases the thickness of the platform.
Innovation Solution
A device and method for orthogonally assembling microstructures with different functionalities and dimensions on a thin substrate using conductive blades and cavities, allowing for multiple interconnects and integration of microfluidic channels, enabling flexible and modular 3D probe arrays for neural applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional in-plane connectors are used, then assembly is simple, but in-plane to off-plane multi-contact connection is not possible
Solution Approach 1:
The patent transitions from in-plane connectors to off-plane connectors by creating cavities that extend vertically from the substrate surface. Multiple conductive blades are arranged within these cavities at different heights and positions, enabling three-dimensional multi-contact connections between probes inserted into the cavities and the substrate circuitry, thus achieving in-plane to off-plane connection capability.
2Adaptability or versatility
If single-contact connections are used, then connection reliability is high, but multi-contact connection is not possible
Solution Approach 1:
The connector is segmented into multiple independent conductive blades within each cavity, where each blade can establish a separate electrical contact. This segmentation allows multiple simultaneous contacts while maintaining the reliability of individual contacts, as each blade operates independently to provide a dedicated connection path.
3Adaptability or versatility
If additional space is provided for 3D probe array assembly, then assembly flexibility is improved, but overall thickness of the platform increases
Solution Approach 1:
Multiple conductive blades are nested within the vertical cavity structure, with blades positioned at different heights and locations inside the same cavity volume. This nesting approach allows complex multi-contact connections to be achieved within a compact vertical footprint, providing assembly flexibility without proportionally increasing the overall platform thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of thin, modular 3D probe arrays with multiple interconnects and microfluidic capabilities, allowing for complex neural recordings and stimulations while minimizing the base thickness, thus improving spatial complexity and functionality without increasing the overall thickness.
Implementation Method 1
a flexible conductive blade (7) overhanging said cavities (4), said flexible conductive blade (7) being adapted for bending into said cavity (4) upon insertion of said connector part (3) in said cavity (4)
Data Source
Figure 1~2(d)
Figure 3(a)~3(c)
Figure 4(a)~5(c)
AI summary
In the present invention a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Also connections to external circuitry can be realised. Also microfluidic channels (10) in the microstructures (20) can be connected to external equipment. Also a method to fabricate and assemble the device is provided.