Orthogonal PCB-Cable Architecture for Low-Loss Network Interconnects
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Solution Overview
Problem
The increasing bandwidth requirements in network devices due to 5G and cloudification lead to higher power consumption and heat dissipation challenges in backplane-free orthogonal system architectures, where long transmission lines necessitate the use of clock data recovery chips, increasing power consumption further.
Innovation Solution
A backplane-free orthogonal system architecture is implemented using vertical inter-insertion between circuit boards via cable assemblies, reducing signal loss and power consumption by eliminating the need for cross transmission lines and minimizing insertion loss through specific connector configurations, such as straight male and curved female connectors, and using cable assemblies to connect boards directly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a backplane-free orthogonal system architecture is used to reduce insertion loss and improve signal rate, then system high-speed performance is improved, but transmission lines on boards are increased and power consumption increases
Solution Approach 1:
The patent extracts the transmission line function from the circuit board and relocates it to a dedicated cable assembly. This separation removes the burden of long transmission lines from the board, eliminating the need for CDR chips while maintaining low insertion loss and reducing power consumption.
Solution Approach 2:
The patent introduces a cable assembly as an intermediary component between connectors to handle high-speed signal transmission. This intermediary carries the transmission line function externally, allowing the board to avoid implementing long transmission lines and associated power consumption issues.
2Adaptability or versatility
If cross transmission lines are split and introduced to two boards to eliminate backplane, then system evolution capability is improved, but transmission line length on boards increases and power consumption increases
Solution Approach 1:
The patent extracts the transmission line function from the board and relocates it to a dedicated cable assembly. This separation removes the burden of long transmission lines from the board, eliminating the need for CDR chips while maintaining low insertion loss and reducing power consumption.
Solution Approach 2:
The patent moves the transmission line from the two-dimensional board plane to a three-dimensional external cable assembly. This dimensional transition allows transmission lines to be routed externally without consuming board space or increasing board complexity, while reducing power consumption.
3Reliability
If board connectors are directly inserted to each other to eliminate backplane, then insertion loss is reduced and signal rate increases, but transmission line length on boards increases requiring CDR chips
Solution Approach 1:
The patent extracts the transmission line function from the board and relocates it to a dedicated cable assembly. This separation removes the burden of long transmission lines from the board, eliminating the need for CDR chips while maintaining low insertion loss and reducing power consumption.
Solution Approach 2:
The patent segments the signal transmission path into distinct functional components: connectors on the board and a separate cable assembly for transmission. This segmentation isolates the transmission line function to a dedicated component, simplifying board design and eliminating the need for additional chips.
Data Source
AI summary
This application provides an orthogonal system architecture and a network device. The orthogonal system architecture includes a first circuit board, a second circuit board, a first connector, and a second connector. The first circuit board and the second circuit board are disposed vertically to each other. The first connector is electrically connected to the first circuit board via a first cable assembly, the second connector is disposed on the second circuit board and is electrically connected to the second circuit board, and the first connector is plug-connected to the second connector, to electrically connect the first circuit board to the second circuit board. When the foregoing structure is used, the first circuit board is electrically connected to the first connector via the first cable assembly.