Orthogonal PCB Interconnect Assembly With Coplanar Spring Contacts

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Solution Overview

Problem

Traditional push-on style connectors for orthogonal circuit board installations in RF applications are costly, require high engagement forces, and involve complex alignment during assembly, especially in high signal count systems.

Innovation Solution

An orthogonal-to-parallel interface assembly using conductive center signal pins, surrounding dielectric retainers, and an outer conductive ground frame, which forms a coplanar contact plane, allowing simultaneous connections with a spring interposer, eliminating the need for individual bullet installation and reducing assembly forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional push-on style connectors with individual bullets are used for each signal, then reliable electrical connection is achieved, but component cost increases and assembly time extends

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidassembly speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent combines multiple individual bullet connectors into a single integrated interface assembly that includes multiple signal pins and a ground frame. This merging reduces the number of separate components from multiple bullets to one unified assembly, thereby reducing component cost and assembly time while maintaining reliable electrical connections for all signals simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The interface assembly is segmented into distinct functional components: signal pins for electrical connection and a ground frame for grounding and alignment. This segmentation allows the assembly to be designed as a single integrated unit that can be installed in one operation, improving assembly speed while ensuring each signal maintains reliable connection through its dedicated pin.

Inventive Principle:
Principle #1Segmentation

2Reliability

If traditional push-on style connectors with individual bullets are used for each signal, then reliable electrical connection is achieved, but device complexity increases due to alignment requirements

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidalignment complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By merging multiple signal pins and the ground frame into a single integrated interface assembly, the patent eliminates the need for separate alignment operations for each bullet. The ground frame provides a unified reference structure that ensures all signal pins are correctly positioned relative to each other, thereby reducing alignment complexity while maintaining connection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The ground frame acts as an intermediary element that mediates the alignment between the interface assembly and the circuit board. It provides a stable reference structure that automatically ensures proper positioning of all signal pins, eliminating the need for complex individual alignment procedures for each connector.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If push-on style connectors are used with high signal counts, then complete signal interconnection is achieved, but engagement force increases significantly

Engineering Contradiction:
Improvesignal count capacityVSAvoidengagement force
Core Design Contradiction:
Adaptability or versatilityVSForce

Solution Approach 1:

The patent merges multiple low-force spring pins into a single interface assembly that connects to the circuit board as one unit. While each individual spring pin requires minimal engagement force, the distributed force across multiple pins in the integrated assembly achieves complete signal interconnection without the cumulative high force that would result from sequentially installing multiple high-force bullets.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the engagement force parameter by using spring-loaded pins instead of rigid push-on connectors. Each spring pin is designed to engage with minimal force, and when combined in an integrated assembly, this parameter change allows high signal count connections to be achieved with reduced overall engagement force compared to traditional bullet connectors.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If traditional push-on style connectors are used, then electrical connection is achieved, but assembly verification complexity increases to ensure bullet alignment

Engineering Contradiction:
Improveelectrical connectionVSAvoidverification method complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By merging all signal pins and the ground frame into a single integrated interface assembly, the patent eliminates the need for verification methods to check individual bullet alignment. The unified structure ensures that if the assembly is correctly positioned using the ground frame as a reference, all signal pins are automatically aligned with their corresponding contacts, thereby reducing verification complexity while maintaining connection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Simplifies design and assembly by reducing the need for alignment methods and lowering overall assembly forces, while enabling multiple connections simultaneously.

Implementation Method 1

spring interposer connector that includes a plurality of signal spring pins and a plurality of ground spring pins

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS12451632B2Orthogonal circuit board interconnection systems
Publication Date: 2025.10.21 LOCKHEED MARTIN CORP
  • US12451632B2 patent drawing
  • US12451632B2 patent drawing
  • US12451632B2 patent drawing

AI summary

According to some embodiments, an interface assembly for coupling an orthogonal circuit board to a main circuit board includes a frame, signal pins, and dielectric retainers. The frame is electrically coupled to a ground signal of the orthogonal circuit board. The dielectric retainers electrically isolate the plurality of signal pins from the frame. The frame includes an interface surface configured to electrically couple the frame to a plurality of ground spring pins of a spring interposer of the main circuit board. Each particular signal pin of the interface assembly includes a pin head configured to electrically couple the particular signal pin to a particular one of a plurality of signal spring pins of the spring interposer. The interface surface of the frame and the pin heads of the plurality of signal pins form a coplanar surface.