Orthogonal PCB Interconnection via Metal Clip
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Solution Overview
Problem
Conventional solutions for interconnecting circuit boards at an angle, such as using coaxial cables or pins, face challenges like high cost, impedance mismatching, and incompatibility with low-cost manufacturing processes, especially when transmitting radio frequency signals between perpendicular boards.
Innovation Solution
A radio frequency interconnection device featuring a surface-mountable single metal clip with a micro-strip line configuration, including a first transmission line connected to a grounding pad and a second transmission line connected to an intermediate terminating pad, with a shunt element enabling wideband interconnection between orthogonal circuit boards, utilizing baseplates to maintain an air gap and minimize short-circuit risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coaxial cables are used to interconnect perpendicular circuit boards, then radio frequency signal transmission is achieved, but the cost becomes prohibitively high
Solution Approach 1:
The patent replaces expensive coaxial cables with a low-cost metal clip structure that can be mass-produced through stamping or molding processes. The metal clip serves as a disposable, single-use interconnection element that achieves RF signal transmission without the high cost of coaxial cables, aligning with the principle of using cheap alternatives for single-function applications.
Solution Approach 2:
The patent substitutes the mechanical coaxial cable system with an electromagnetic field-based metal clip structure. The metal clip creates electromagnetic coupling between the circuit boards, replacing the physical mechanical connection of coaxial cables with an electromagnetic field transmission mechanism, thereby reducing cost while maintaining RF signal integrity.
2Reliability
If pins are used for board-to-board interconnection of radio frequency signals, then signal transmission is achieved, but the manufacturing process becomes incompatible with low-cost technologies and large fabrication tolerances
Solution Approach 1:
The patent changes the geometric parameters of the metal clip structure, specifically designing it with a U-shape configuration that provides mechanical compliance and tolerance absorption. This parameter change allows the structure to accommodate large fabrication tolerances typical of low-cost manufacturing processes while maintaining effective RF signal transmission, unlike rigid pin structures.
Solution Approach 2:
The metal clip structure functions as a flexible interconnection element that can deform to accommodate manufacturing variations. The clip's inherent flexibility allows it to maintain electrical contact and RF signal transmission despite variations in board positioning and fabrication tolerances, making it compatible with low-cost manufacturing processes.
3Manufacturing precision
If ground pins are placed very close to signal pins to minimize impedance mismatching, then impedance matching is improved, but the solution becomes incompatible with low-cost technologies and large fabrication tolerances
Solution Approach 1:
The patent transitions from a two-dimensional pin placement problem to a three-dimensional metal clip structure. The clip extends in multiple dimensions, providing ground connections at multiple points along its length, which maintains impedance matching without requiring precise single-point positioning. This dimensional change allows tolerance absorption while maintaining electrical performance.
Solution Approach 2:
The metal clip structure segments the ground connection into multiple discrete contact points along its length, rather than relying on a single ground pin. This segmentation provides multiple opportunities for electrical contact, ensuring impedance matching is maintained even when individual contact points vary due to fabrication tolerances.
4Ease of manufacture
If U-shaped metal clips are used for interconnection, then low cost is achieved, but at least two clips are required (one for signal, one for ground) increasing complexity
Solution Approach 1:
The patent merges the signal and ground functions into a single integrated metal clip structure. The U-shaped clip simultaneously provides both signal transmission and ground reference functions through its different segments, eliminating the need for separate signal and ground clips. This consolidation reduces the total number of components while maintaining low-cost manufacturing advantages.
Solution Approach 2:
The metal clip is designed as a universal interconnection element that performs multiple functions: signal transmission, ground reference, and mechanical support. This multi-functional design eliminates the need for specialized separate components for each function, reducing overall device complexity while maintaining cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transmits radio frequency signals across a wide frequency range, including WLAN applications, while being cost-effective and compatible with high-volume production, achieving a bandpass filtering response and suitable for dual-band WLAN applications up to 6 GHz.
Implementation Method 1
The metal part enables the interconnection of two circuit boards (for example, main printed circuit boards PCBs) arranged, for example, perpendicularly
Implementation Method 2
a first transmission line connected to a grounding pad and a second transmission line connected to an intermediate terminating pad
Data Source
AI summary
An interconnection system is described including a first printed circuit board, the first printed circuit board including a first portion of a filter, the filter used to communicate a signal between the first printed circuit board and a second printed circuit board, and a mechanical structure for coupling the signal between the first printed circuit board and the second printed circuit board, the second printed circuit board being oriented at an angle with respect to the first printed circuit board.