Orthogonal PCB Interconnect Assembly for Low-Force Blind Mating

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Solution Overview

Problem

Traditional push-on style connectors for orthogonal circuit board installations in RF applications require individual bullets for each signal, leading to costly components, extended assembly time, and high engagement forces, with alignment issues during blind-mate applications.

Innovation Solution

An orthogonal-to-parallel interface assembly using conductive center signal pins, surrounding dielectric retainers, and an outer conductive ground frame, allowing a parallel connection to a spring interposer, eliminating the need for individual bullet installation and reducing assembly forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional push-on style connectors with individual bullets are used for each signal, then reliable electrical connection is achieved, but component cost increases and assembly time extends

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidassembly speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent combines multiple individual bullet connectors into a single integrated connector assembly that establishes multiple electrical connections simultaneously. This single assembly includes multiple contact elements arranged to engage with corresponding contacts on the circuit board, allowing all signal connections to be made in one insertion action rather than requiring separate installation of individual bullets for each signal.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If traditional push-on style connectors with individual bullets are used for each signal, then reliable electrical connection is achieved, but component cost increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidcomponent cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If high engagement force per signal pin is applied to ensure connection, then connection reliability is improved, but total engagement force for high signal counts becomes excessively large

Engineering Contradiction:

Improveconnection reliabilityVSAvoidtotal engagement force

Core Design Contradiction:

ReliabilityVSForce

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

4Ease of operation

If blind-mate installation method is used, then assembly simplicity is improved, but alignment verification becomes difficult and misalignment may occur

Engineering Contradiction:

Improveassembly simplicityVSAvoidalignment accuracy

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The connector assembly is segmented into distinct functional zones with signal contacts arranged in specific patterns, allowing the system to maintain alignment through the geometric arrangement of contacts rather than requiring active alignment verification during assembly.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20260088536A1Orthogonal Circuit Board Interconnection Systems

Publication Date: 2026.03.26 LOCKHEED MARTIN CORP

AI summary

According to some embodiments, an interface assembly for coupling an orthogonal circuit board to a main circuit board includes a frame, signal pins, and dielectric retainers. The frame is electrically coupled to a ground signal of the orthogonal circuit board. The dielectric retainers electrically isolate the plurality of signal pins from the frame. The frame includes an interface surface configured to electrically couple the frame to a plurality of ground spring pins of a spring interposer of the main circuit board. Each particular signal pin of the interface assembly includes a pin head configured to electrically couple the particular signal pin to a particular one of a plurality of signal spring pins of the spring interposer. The interface surface of the frame and the pin heads of the plurality of signal pins form a coplanar surface.