Orthogonal Plasma Sensing Devices for 2D Distribution Mapping
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Solution Overview
Problem
Current plasma processing technologies face challenges in accurately monitoring and controlling plasma processes due to the low sensitivity of existing devices, which limits the ability to achieve precise chemical composition and impurity control in plasma chambers, particularly in integrated circuit manufacturing.
Innovation Solution
A plasma monitoring system comprising two plasma sensing devices positioned orthogonally to each other within a plasma chamber, generating detection signals that are used to perform a convolution operation to provide two-dimensional plasma distribution information, enabling precise control of plasma processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single plasma sensing device is used to monitor the plasma chamber, then the device complexity is low, but the measurement precision is insufficient due to low sensitivity
Solution Approach 1:
The plasma sensing system is segmented into multiple sensing devices positioned at different locations within the plasma chamber. Each sensing device independently monitors plasma parameters from its specific position, and the results are combined to form a comprehensive two-dimensional or three-dimensional plasma distribution map, thereby improving measurement precision without requiring a single overly complex device
Solution Approach 2:
The system transitions from single-point monitoring to multi-dimensional monitoring by positioning sensing devices at different spatial coordinates within the plasma chamber. This dimensional expansion enables the construction of two-dimensional or three-dimensional plasma distribution information, significantly enhancing the accuracy and comprehensiveness of plasma parameter measurement
2Measurement precision
If multiple plasma sensing devices are positioned at different locations, then the measurement precision and plasma distribution information are improved, but the device complexity increases
Solution Approach 1:
Each plasma sensing device is designed with multi-functionality to perform multiple measurement tasks simultaneously. The devices can monitor various plasma parameters (electron temperature, plasma density, etc.) and contribute to both local measurements and overall plasma distribution mapping, reducing the need for multiple specialized devices and thereby managing system complexity
3Manufacturing precision
If plasma parameters are monitored in real-time with high precision, then the manufacturing precision of plasma processes is improved, but the use of energy increases
Solution Approach 1:
The system replaces mechanical or invasive measurement methods with optical sensing techniques. By using optical probes to monitor plasma parameters remotely without physical contact or interference with the plasma process, the system achieves high-precision real-time monitoring while minimizing additional energy consumption and avoiding disruption to the plasma environment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the productivity of plasma processes by providing real-time two-dimensional or three-dimensional plasma distribution information, allowing for more accurate control and improving the precision of plasma processing in integrated circuit manufacturing.
Implementation Method 1
generates a first detection signal with respect to the monitoring plasma plane based on a first incident beam radiated from the monitoring plasma plane
Implementation Method 2
a diffraction grating to divide the other of the two split line beams to generate per-wavelength diffraction beams
Data Source
AI summary
A plasma monitoring system includes a plasma chamber performing plasma processes, first and second plasma sensing devices, and a controller. The first and second plasma sensing devices are respectively in a first horizontal direction and a second horizontal direction perpendicular to each other from a center point of a monitoring plasma plane in the plasma chamber. The first and second plasma sensing device generate first and second detection signals with respect to the monitoring plasma plane based on a first incident beam radiated from the monitoring plasma plane in the first horizontal direction and a second incident beam radiated from the monitoring plasma plane in the second horizontal direction. The controller detects two-dimensional plasma distribution information with respect to the monitoring plasma plane by performing a convolution operation based on the first and second detection signals, and controls the plasma processes based on the two-dimensional plasma distribution information.