Orthogonal Polarizer Shielding for Semiconductor EMI Reduction

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Solution Overview

Problem

Conventional shielding techniques fail to adequately inhibit near-field electromagnetic interference (EMI) between electronic devices, leading to potential harm to humans and malfunctions in semiconductor chips and antennas.

Innovation Solution

The implementation of an electronic device design featuring a circuit substrate with a first and second semiconductor package, where an insulating electromagnetic shielding structure with orthogonal polarizers is applied on top and lateral surfaces of the first semiconductor package, and a conductive shielding structure covers both packages, effectively cutting off electromagnetic waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional single-layer shielding is used, then the structure is simple and easy to manufacture, but the electromagnetic interference inhibition is insufficient

Engineering Contradiction:

Improveshielding structure fabricationVSAvoidelectromagnetic interference

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The shielding structure is divided into multiple functional layers: a first shielding layer with first polarizers, a second shielding layer with second polarizers having orthogonal transmission axes, and an insulating layer between them. This segmentation allows each layer to contribute differently to EMI inhibition while maintaining manufacturability through standard layered fabrication processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite shielding materials combining conductive polarizing materials with insulating materials. The composite structure of conductive polarizers embedded in insulating matrices provides both EMI shielding capability and electrical insulation, resolving the contradiction between simple structure and effective shielding.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If multi-layer shielding with orthogonal polarizers is implemented, then electromagnetic interference inhibition is improved, but the device complexity increases

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidshielding structure configuration

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Each shielding layer serves multiple functions: blocking electromagnetic waves with specific polarization orientations, providing electrical insulation (when using insulating polarizer materials), and maintaining structural integrity. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent changes the transmission axis orientation parameter of successive shielding layers (orthogonal arrangement) to enhance EMI inhibition. This parameter modification allows the same basic shielding structure to be tuned for different interference scenarios without fundamental redesign, managing complexity while improving performance.

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If shielding structures are added to cut off electromagnetic waves, then electromagnetic interference protection is improved, but the manufacturing process becomes more difficult

Engineering Contradiction:

Improveelectromagnetic wave interferenceVSAvoidfabrication process

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The insulating layer is formed between the first and second shielding layers during the initial fabrication sequence, before final assembly. The polarizers are pre-aligned and fixed in their respective layers during manufacturing, eliminating the need for complex post-assembly alignment procedures and simplifying the overall fabrication process.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces electromagnetic interference, protecting both the semiconductor chips and external devices from electromagnetic waves, while preventing interference with human bodies and other electronic devices.

Implementation Method 1

The insulating electromagnetic shielding structure may include a first polarizer having a first transmission axis, and a second polarizer having a second transmission axis orthogonal to the first transmission axis of the first polarizer

Methodology Applied

Scientific EffectPolarisation: Polarisation

Data Source

PatentUS9496226B2Semiconductor device, semiconductor package, and electronic device

Publication Date: 2016.11.15 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.