Orthogonal Power Plane and Bus Bar Layout for High-Current Processors
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Solution Overview
Problem
Existing electronic devices face significant power loss when conducting high currents due to the reduction in voltage required for low-voltage processors, necessitating power conversion circuits with reduced loss.
Innovation Solution
A power delivery system utilizing a power plane with orthogonal blade assemblies and DC to DC converters that sequentially reduce voltage and increase current, minimizing losses through bus bars with increased cross-sectional area for high-current conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional circuit boards are used to conduct high currents for low-voltage processors, then power conversion is achieved, but significant power loss occurs
Solution Approach 1:
The patent transitions from planar circuit board power distribution to a three-dimensional power delivery architecture using vertical blade assemblies with bus bars. This dimensional change allows power to be delivered through multiple layers and directions, reducing current density and associated power losses in any single conductor while maintaining compact form factor.
Solution Approach 2:
The power delivery system is segmented into multiple blade assemblies, each handling a portion of the total power load. This segmentation distributes the high current across multiple parallel paths with bus bars, reducing the current burden on any single conductor and thereby minimizing I²R power losses.
2Adaptability or versatility
If voltage is reduced for low-voltage processors, then compatibility is achieved, but current increases causing significant power loss
Solution Approach 1:
The patent employs vertical blade assemblies that extend in the third dimension, allowing multiple DC-to-DC converter circuits to be stacked and connected through vertical bus bar connections. This three-dimensional arrangement reduces the horizontal current path length and resistance, minimizing power losses while delivering the high currents required for low-voltage processor operation.
Solution Approach 2:
Bus bars serve as intermediary conductors between the power plane and the DC-to-DC converter circuits. These thick, low-resistance bus bars efficiently transfer high currents with minimal voltage drop and power loss, acting as optimal intermediaries between the power source and the voltage regulation stages.
3Power
If high currents are conducted through traditional circuit boards, then power delivery is achieved, but power loss increases significantly
Solution Approach 1:
The patent utilizes vertical blade assemblies with bus bars extending in the vertical dimension, creating multiple parallel current paths. This three-dimensional power delivery architecture reduces current density and resistance compared to planar circuit boards, enabling high power delivery with minimized I²R losses.
Solution Approach 2:
The power delivery system employs composite construction combining blade boards with thick copper bus bars. This composite structure leverages the low electrical resistance of copper bus bars for high-current conduction while using the blade board structure for mechanical support and electrical isolation, achieving optimal power delivery efficiency.
4Loss of energy
If blade assemblies are arranged orthogonally with increased bus bar thickness, then high-current conduction is improved, but manufacturing complexity increases
Solution Approach 1:
The power delivery system is divided into modular blade assemblies that can be manufactured separately and then assembled. Each blade assembly contains integrated bus bars and DC-to-DC converter circuits, allowing standardized mass production of modules that are then configured in orthogonal arrangements, balancing manufacturing simplicity with performance optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves reduced size, minimized parasitic losses, and efficient delivery of high currents to processors, enhancing operating efficiency and heat dissipation.
Implementation Method 1
bus bars with increased cross-sectional area for high-current conduction
Implementation Method 2
DC to DC converter circuits that sequentially reduce voltage and increase current
Data Source
AI summary
An electronic device includes a power plane arranged to receive input power and to distribute the input power to a plurality of blade board assemblies. Each of the blade board assemblies include one or more DC to DC converter circuits that convert the received power into power that is delivered to a processor. Metallic bus bars are attached to each blade board assembly to conduct high current from the power plane, across the blade board assembly and to the DC to DC converter circuits. After DC to DC conversion by the DC to DC converter circuits, additional bus bars are used to conduct the high current across the blade board assembly to the processor, which may be attached to a motherboard.