Orthogonal Reinforcement Structure in Package Substrates for Warpage

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing packaging solutions for integrated circuits (ICs) face challenges in managing warpage due to mismatched coefficients of thermal expansion (CTE) between materials, leading to warping and stress in interconnects, with current methods being costly, limited in effectiveness, and increasing package height.

Innovation Solution

A package substrate with a reinforcement structure comprising flexible and rigid columns and channels made of dielectric and conductive materials, designed to absorb deflections and increase stiffness, customizable for specific configurations, reducing warpage and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If external stiffeners are added to control warpage, then warpage control improves, but package height increases and device complexity increases

Engineering Contradiction:

Improvewarpage controlVSAvoidpackage height

Core Design Contradiction:

Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The reinforcement structure is embedded within the package substrate itself, nesting the stiffening function inside the existing substrate layers rather than adding external components. This eliminates the need for external stiffeners while maintaining warpage control, thereby reducing package height without sacrificing structural stability

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The reinforcement structure combines multiple functions into a single integrated component within the substrate: mechanical stiffening, electrical interconnection (through conductive columns), and structural support. This merging eliminates the need for separate external stiffeners, reducing both package height and device complexity while maintaining effective warpage control

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If external stiffeners are added to control warpage, then warpage control improves, but device complexity and packaging costs increase

Engineering Contradiction:

Improvewarpage controlVSAvoidpackaging complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The reinforcement structure integrates mechanical reinforcement, electrical interconnection, and structural support functions into a single embedded component system. This consolidation eliminates the need for separate external stiffeners and their associated assembly processes, thereby reducing device complexity and packaging costs while maintaining effective warpage control

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The embedded reinforcement structure serves multiple functions simultaneously: providing mechanical stiffening to control warpage, establishing electrical interconnections through conductive columns, and offering structural support for mounted components. This multi-functionality replaces what would traditionally require multiple separate components, reducing overall packaging complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If material mismatch is not addressed, then manufacturing is simpler, but warpage and interconnect stress increase

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidwarpage and stress

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The reinforcement structure is strategically positioned in specific regions of the package substrate where warpage and stress concentration occur due to material mismatch. By placing stiffer reinforcement elements locally in these critical areas, the design addresses thermal expansion differences between materials without requiring a complete redesign of the entire manufacturing process, thus maintaining manufacturing simplicity while effectively controlling warpage and interconnect stress

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reinforcement structure effectively controls warpage, improves assembly handling, enhances package reliability, and reduces the risk of chip cracks and interconnect failures, while potentially eliminating external stiffeners and lowering packaging costs.

Implementation Method 1

mismatched coefficients of thermal expansion (CTE) between materials, leading to warping and stress in interconnects

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

The rigid material has a higher elastic modulus than the dielectric material

Methodology Applied

Scientific EffectElastic modulus: Elasticity

Data Source

PatentUS12550736B2Packaging architecture with reinforcement structure in package substrate

Publication Date: 2026.02.10 INTEL CORP

AI summary

Embodiments of a microelectronic assembly include a package substrate comprising: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising columns of the first material; and a third layer comprising a second plurality of mutually parallel channels of the first material, the second plurality of mutually parallel channels being orthogonal to the first plurality of mutually parallel channels. The second layer is between the first layer and the third layer, at least some columns extend between and contact the first plurality of mutually parallel channels and the second plurality of mutually parallel channels, and at least a portion of the first layer, the second layer and the third layer comprises a second material different from the first material.