Orthogonal Surface Connector Using Pillars and Conductive Balls
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Solution Overview
Problem
Existing connectors in electronic systems and devices face challenges in efficiently connecting components with orthogonal surfaces, and manufacturing methods lack effective solutions for integrating lateral surfaces of components with upper surfaces of plates.
Innovation Solution
A connector system using stacks of electrically-conductive pillars and conductive balls to electrically couple contacts on orthogonal surfaces, formed through a wireless solder technique, with pillars made of copper or copper alloys, and a bonding method that includes gluing the lateral surface of a die to the upper surface of a wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connectors are used to connect contacts on orthogonal surfaces, then connection between components is achieved, but the connector structure becomes complex and manufacturing difficulty increases
Solution Approach 1:
The connector is segmented into multiple functional components: conductive pillars formed on contacts, conductive balls positioned between pillars, and adhesive layers for bonding. This segmentation allows each component to perform its specific function independently, simplifying the overall structure while maintaining connection reliability between orthogonal surfaces
Solution Approach 2:
The invention transitions from planar connections to three-dimensional orthogonal connections by using vertical conductive pillars and spherical conductive balls. This dimensional change enables electrical connection between contacts on surfaces that are perpendicular to each other, eliminating the need for complex lateral routing structures
2Adaptability or versatility
If lateral surface of die is bonded to upper surface of wafer, then connectivity between orthogonal surfaces is enabled, but manufacturing process complexity increases
Solution Approach 1:
Conductive pillars are formed on contacts and adhesive layers are applied to surfaces before the bonding step. This preliminary preparation allows the actual bonding process to be simpler and more reliable, as all connection elements are already in place and properly positioned prior to joining the orthogonal surfaces
Solution Approach 2:
An adhesive layer acts as an intermediary substance between the lateral surface of the die and the upper surface of the wafer. This intermediary enables reliable bonding of orthogonal surfaces while accommodating slight misalignments and surface irregularities, simplifying the manufacturing process
3Adaptability or versatility
If multiple connection methods are used for orthogonal surfaces, then connection flexibility is improved, but manufacturing time and complexity increase
Solution Approach 1:
The invention merges multiple functions into a single integrated connector structure: electrical conduction through conductive pillars and balls, mechanical bonding through adhesive layers, and orthogonal surface alignment. This combination eliminates the need for separate connection methods and steps, improving manufacturing efficiency while maintaining connection flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient electrical coupling of contacts on orthogonal surfaces, improving connectivity and manufacturing efficiency by using a method that adapts to different component orientations and materials.
Implementation Method 1
said first pillar(s) are formed by using a tool adapted to a wireless solder technique
Implementation Method 2
the first lateral surface of said die is bonded to the first upper surface of said wafer by gluing
Data Source
AI summary
The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).