Orthogonal Switch Card Connectors for High-Density Network Devices
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Solution Overview
Problem
Network devices face challenges in packaging density due to connector pin density and area limitations on printed circuit boards, signal loss in connections between switch cards and line cards, and airflow obstructions, which affect design efficiency and performance.
Innovation Solution
The implementation of a switch card with a switch chip and multiple connectors that couple to multiple line cards via a connection cartridge, utilizing orthogonal connectors and twinax cables to reduce signal loss and increase airflow, while allowing for a modular configuration that simplifies installation and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple connectors are added to switch cards to connect more line cards, then connectivity increases, but connector pin density and area consumption increase
Solution Approach 1:
The patent transitions from traditional 2D connector arrangements on the same plane to a 3D orthogonal configuration where connectors are positioned at right angles to each other. This dimensional change allows multiple connectors to be packed more densely without increasing the footprint area, resolving the contradiction between connectivity and area consumption.
Solution Approach 2:
The patent implements a nested connector architecture where connectors are arranged in overlapping or interlocking patterns, allowing one connector structure to be partially contained within or alongside another. This nesting approach maximizes the use of available space, enabling higher connectivity without proportional increases in connector area.
2Device complexity
If traditional connection methods are used between switch cards and line cards, then simplicity is maintained, but signal loss increases
Solution Approach 1:
The patent extracts the connection function from the traditional monolithic switch card architecture and separates it into dedicated connection cartridges. These cartridges contain optimized signal pathways and connectors that are specifically designed to minimize signal loss, while the switch card itself focuses on switching logic. This extraction resolves the contradiction by allowing optimized connections without complicating the overall system.
3Area of stationary object
If dense connector arrangements are used to increase packaging density, then space utilization improves, but airflow obstructions increase
Solution Approach 1:
By arranging connectors in orthogonal 3D configurations rather than dense 2D layouts, the patent creates vertical and horizontal layers that allow cooling airflow to pass through gaps between connector planes. This dimensional arrangement maintains high space utilization while preserving airflow pathways, resolving the contradiction between packaging density and cooling efficiency.
Data Source
AI summary
In some implementations, a switch card is provided. The switch card includes a set of switch chips configured to communicate data with a plurality of line cards. The plurality of line cards is coupled to a second switch card. The second switch card comprises a second set of switch chips. The switch card also includes a communication component coupled to the set of switch chips. The communication component is configured to determine whether the switch card should operate in a master mode or a slave mode. In response to determining that the switch card should operate in the master mode, the switch card is also configured to receive control plane data from a supervisor card. The switch card is further configured to communicate the control plane data to one or more switch chips of the set of switch chips and the second set of switch chips.