Orthogonal Switch Stacking for Dense Network Topologies
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Solution Overview
Problem
Existing solutions for assembling networking components in large-scale indirect network topologies are either low-density and costly or compromise signal integrity by increasing node connections, which leads to electromagnetic interference.
Innovation Solution
A high-density packaging scheme where global switches and node switches are orthogonally oriented and co-located within a cabinet, using short, low-cost copper cables for node connections and longer, higher-cost fiber optic cables for global connections, optimizing spatial arrangement to reduce cable length and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If node switches are co-located with global switches in high-density packaging, then spatial efficiency and cable length are improved, but electromagnetic interference and signal integrity deteriorate
Solution Approach 1:
The patent applies orthogonal orientation where node switches and global switches are arranged perpendicular to each other within the same cabinet space. This dimensional arrangement allows dense packaging while maintaining physical separation between connection types, reducing electromagnetic interference between node switch cables and global switch cables.
Solution Approach 2:
The patent assigns different cable types to different connection zones: copper cables are used for node switch connections where short length is critical, while fiber optic cables are used for global switch connections where longer distances are acceptable. This local optimization balances cost and signal integrity requirements.
2Reliability
If copper cables are used for node connections, then cost is reduced, but signal integrity deteriorates with increased cable length
Solution Approach 1:
The patent changes the cable length parameter by co-locating node switches with global switches in the same cabinet, reducing cable length from meters to feet. This parameter change allows the use of cheaper copper cables while maintaining signal integrity that would otherwise require expensive fiber optic cables.
3Reliability
If node switches are placed at the top of separate cabinets, then signal integrity is maintained with shorter cables, but spatial efficiency and density deteriorate
Solution Approach 1:
The patent merges node switches and global switches into the same cabinet space with orthogonal orientation, combining functions that were previously separated into different locations. This merging achieves high density while using dimensional separation to maintain signal integrity.
4Reliability
If fiber optic cables are used for global connections, then signal integrity is maintained over longer distances, but cost increases
Solution Approach 1:
The patent applies local quality by using fiber optic cables specifically for global switch connections where longer cable runs are necessary, while using cheaper copper cables for node switch connections where short length suffices. This localized application optimizes the balance between signal integrity and cost.
Data Source
AI summary
Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switches are oriented orthogonally to the stack of global switches. Additionally, the first set of ports are oriented towards the second set of ports and the node switches are connected to the global switches through the first and second sets of ports. Other embodiments are also described and claimed.