Orthogonal Waveguide Optical Modulator for Power Reduction
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Solution Overview
Problem
High-bandwidth coherent driver modulators (HB-CDM) face challenges with increased chip size due to the need for polarization coupling and optical systems, leading to higher power consumption and modulation loss, as the length of the chip is reduced to accommodate these systems, which limits the number of chips per wafer and increases costs.
Innovation Solution
The optical modulator design features input and output waveguides oriented in orthogonal directions on the chip, allowing the optical systems to be disposed in the width direction rather than the length direction, thereby maximizing the chip length and reducing the drive voltage and power consumption, while maintaining optical signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the chip length is reduced to accommodate optical systems, then the optical systems can be integrated into the package, but the drive voltage and power consumption increase
Solution Approach 1:
The patent applies dimensionality change by orienting the input and output waveguides in orthogonal directions on the chip surface. This allows the optical systems to be disposed in the width direction rather than the length direction, effectively utilizing two-dimensional space on the chip. By changing the spatial arrangement from a linear configuration to an orthogonal configuration, the chip length can be maximized while still accommodating the optical systems, thereby reducing drive voltage and power consumption without sacrificing integration.
2Device complexity
If the chip length is reduced to accommodate optical systems, then the optical systems can be integrated into the package, but modulation loss increases
Solution Approach 1:
The orthogonal orientation of waveguides enables the optical systems to be positioned in the width direction, preserving chip length and reducing modulation loss through shorter interaction lengths.
Solution Approach 2:
The chip is segmented into distinct functional regions with input waveguides at one end and output waveguides at a side surface. This segmentation allows independent optimization of different sections, enabling the optical systems to be positioned optimally without compromising the modulation section's performance.
3Use of energy by moving object
If the chip length is increased to reduce drive voltage, then power consumption decreases, but the optical systems cannot be accommodated in the package
Solution Approach 1:
By utilizing orthogonal directions for waveguide orientation, the invention maximizes the effective use of chip area. This allows both long interaction lengths for low drive voltage and sufficient space for optical systems to be accommodated within the package, resolving the contradiction between chip length requirements for voltage reduction and space requirements for system integration.
4Loss of energy
If the chip length is increased to reduce drive voltage, then modulation loss decreases, but the optical systems cannot be accommodated in the package
Solution Approach 1:
The orthogonal waveguide configuration allows the chip to maintain sufficient length for low modulation loss while accommodating optical systems in the width direction, eliminating the trade-off between these two requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the characteristics of the optical modulator by reducing drive voltage, power consumption, and modulation loss, while allowing for a longer chip length, thus improving the overall performance and reducing costs by increasing the number of chips per wafer.
Implementation Method 1
a chip that optically modulates the optical signal
Implementation Method 2
an input waveguide and an output waveguide of the optical signal
Data Source
AI summary
An optical modulator in which an optical signal is input from one side of a package, includes in the package, a chip that optically modulates the optical signal and in which an input waveguide and an output waveguide of the optical signal are led to mutually different destinations each being one end of the chip facing the one side of the package and a side surface of the chip orthogonal to the one end of the chip; an input optical system coupled to the input waveguide of the chip; and an output optical system coupled to the output waveguide of the chip.