Multi-Level Oscillating Heat Pipe for Circuit Card Thermal Management
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Solution Overview
Problem
Current oscillating heat pipe designs are limited to planar structures, which restrict their effectiveness in thermal dissipation for high-power electronic circuit card modules due to reliance on two-dimensional heat conduction paths, leading to high thermal resistance at the module edges.
Innovation Solution
The implementation of a multi-level oscillating heat pipe structure that extends fluid paths into three-dimensional configurations within the body, sidewalls, and flanges of the module, allowing for phase change and vapor bubble movement between evaporators and condensers, thereby reducing thermal resistance and enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If planar oscillating heat pipe structures are used, then the structure is simple and easy to manufacture, but thermal resistance at module edges is high and heat dissipation effectiveness is limited
Solution Approach 1:
The patent transitions from two-dimensional planar oscillating heat pipe structures to three-dimensional multi-level configurations. The fluid path extends vertically through multiple levels of the module, with evaporators positioned at different heights and condensers contacting the coldwall directly. This dimensional expansion creates additional heat transfer pathways that reduce thermal resistance at module edges while maintaining manufacturing feasibility through standardized component integration.
2Temperature
If fluid paths are extended into three-dimensional configurations, then thermal resistance is reduced and heat transfer is enhanced, but device complexity increases
Solution Approach 1:
The three-dimensional fluid path is segmented into distinct functional sections: evaporator zones at multiple levels, vertical transport channels through sidewalls, and condenser regions contacting the coldwall. Each segment performs a specific thermal function, allowing the complex overall system to be designed and manufactured using standardized modular components rather than a single monolithic structure.
Solution Approach 2:
The oscillating heat pipe fluid path is nested within the structural framework of the module, utilizing the existing body, sidewalls, and flange geometries. The thermal conduction members are integrated into the module housing, with fluid channels routed through available spaces rather than requiring separate external components, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal resistance from the module edges to the coldwall by enabling direct contact of the condenser with the coldwall, improving heat dissipation efficiency and extending the benefits of oscillating heat pipes beyond the planar core.
Implementation Method 1
an oscillating heat pipe configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe
Implementation Method 2
phase change of fluid slugs and vapor bubbles within the oscillating heat pipe
Implementation Method 3
phase change of fluid slugs and vapor bubbles within the oscillating heat pipe
Implementation Method 4
an oscillating heat pipe configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges
Data Source
Figure 1A
Figure 1B
Figure 2~3C
AI summary
One or both of a module cover (102) and a heat sink (103) for a circuit card module (100) includes a multi-level cooling structure (300) formed by a body (301), sidewalls (302) extending from edges of the body and, together with the body, partially enclosing a volume, flanges (303) projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe (304) within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator (308) adjacent a first of the flanges and a condenser (309) adjacent a second of the flanges.