Oscillating Heat Spreader With Thermoelectric Cooling for Package Heat
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Solution Overview
Problem
Electronic and optoelectronic devices face significant thermal management challenges due to die-level and package-level thermal constraints, with over 70% of transistor junction-to-ambient thermal resistance within the package, necessitating efficient heat spreading and transport within the package and to its exterior.
Innovation Solution
The integration of an oscillating heat spreader with interconnected channels containing a working fluid, combined with thermoelectric coolers and heat exchange features like protrusions and splitters, enhances heat transfer by utilizing phase change and capillary action to circulate the working fluid effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional heat dissipation methods are used in packaged devices, then device integration is achieved, but thermal management becomes challenging with high thermal resistance within the package
Solution Approach 1:
The patent employs a heat pipe with working fluid circulation to transfer heat from the packaged device to external heat sinks. The heat pipe utilizes phase change of the working fluid (evaporation at hot end, condensation at cold end) to achieve efficient heat transport, effectively reducing thermal resistance within the package while maintaining device integration.
Solution Approach 2:
The heat pipe operates by utilizing phase transitions of the working fluid between liquid and vapor states. Heat applied at the evaporator section causes liquid to vaporize, the vapor travels to the condenser where it condenses back to liquid, and the liquid returns to the evaporator through capillary action or gravity, creating a continuous heat transfer cycle that overcomes thermal resistance constraints.
2Reliability
If heat pipe structures are integrated into packaged devices, then thermal management efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates the heat pipe structure directly with the packaged device, merging the thermal management function with the device housing or substrate. This integration approach improves thermal management efficiency while minimizing the increase in device complexity by combining multiple functions into a unified structure rather than adding separate components.
Solution Approach 2:
The heat pipe acts as an intermediary thermal management component between the heat-generating packaged device and external heat sinks. It serves as a mediator that efficiently transfers heat without requiring direct thermal contact between the device and cooling system, thereby improving thermal management while maintaining relatively simple device architecture.
3Productivity
If multiple cooling mechanisms are employed (heat pipes, thermoelectric coolers), then heat transfer efficiency is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the thermal management system into distinct functional segments: heat pipe sections for heat transport, thermoelectric cooler sections for active cooling, and heat sink sections for heat dissipation. This segmentation allows each component to be optimized and manufactured separately using appropriate processes, then assembled into an integrated system, thereby enhancing heat transfer efficiency while managing manufacturing complexity through modular construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat transfer efficiency, reducing temperature differentials and cooling power requirements, while allowing for tailored thermal management of components with different thermal needs, enhancing the reliability and performance of electronic and optoelectronic devices.
Implementation Method 1
utilizing phase change and capillary action to circulate the working fluid effectively
Implementation Method 2
utilizing phase change and capillary action to circulate the working fluid effectively
Implementation Method 3
combined with thermoelectric coolers and heat exchange features
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C
AI summary
A device, and method of operating the device, are disclosed. The device comprises: a heat spreader having a first side and a second side opposite the first side, the heat spreader comprising at least one oscillating heat pipe arranged between the first side and the second side, at least one of the at least one oscillating heat pipe comprising a plurality of interconnected channels comprising a working fluid; at least one optoelectronic component coupled to the first side of the heat spreader; and at least one thermoelectric cooler, wherein a cold side of the at least one thermoelectric cooler is coupled to the second side of the heat spreader. The heat spreader may comprise one or more heat exchange features.