Oscillating Polishing Path to Eliminate Surface Marks
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Solution Overview
Problem
Conventional polishing methods often result in undesirable polishing marks on work pieces due to the linear reciprocating movement of polishing tools, which can leave residual marks that require additional processing to remove, introducing errors and reducing operational efficiency.
Innovation Solution
A method and system that utilize a combination of first and second polishing path components with a saw-tooth or sinusoidal pattern, where the tool's polishing area rotates and oscillates in opposite directions to intersect and eliminate polishing edges formed in previous cycles, maintaining continuous contact with the work piece and integrating polishing and mark removal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a straight polishing path is guided repetitively in a linear reciprocating movement, then the polishing process is simple and efficient, but polishing marks are formed on the work piece surface
Solution Approach 1:
The invention applies a curved sinusoidal polishing path instead of a straight linear path. The tool center moves along a sinusoidal trajectory defined by equations involving amplitude A and wavelength λ, creating a curved motion pattern that eliminates polishing marks while maintaining polishing efficiency.
Solution Approach 2:
The invention uses periodic sinusoidal oscillation in the polishing path. The tool center position varies periodically according to sinusoidal functions, creating a repeating curved pattern that continuously varies the polishing direction and prevents mark formation throughout the polishing process.
2Manufacturing precision
If another straight polishing path is guided in a direction normal to the first path to reduce polishing marks, then surface quality improves, but additional polishing time is required and marks may still remain
Solution Approach 1:
The sinusoidal polishing path performs multiple functions simultaneously: it provides the primary polishing action while also eliminating polishing marks through its curved geometry. This single unified path replaces the need for separate polishing and mark-removal passes, achieving both functions in one operation.
Solution Approach 2:
The curved sinusoidal trajectory inherently provides the directional variation needed to eliminate marks, eliminating the need for a second perpendicular pass. The continuous curvature of the path ensures that polishing edges are constantly varied and prevented from forming.
3Manufacturing precision
If polishing regions are made to overlap to eliminate polishing marks, then surface quality improves, but a separate polishing path is required for mark removal, reducing operational efficiency
Solution Approach 1:
The sinusoidal polishing path integrates both polishing and mark-removal functions into a single operational sequence. The overlapping regions created by the sinusoidal pattern automatically perform mark elimination, eliminating the need for separate mark-removal paths and maintaining high operational efficiency throughout the entire process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively eliminates polishing marks without the need for subsequent removal paths, enhancing polishing quality and operational efficiency by maintaining tool engagement and reducing errors associated with disengagement and re-engagement, while improving the robot system's operation efficiency.
Implementation Method 1
a tool with a polishing area is moved relative to a work piece with engaging the polishing area of the tool and a portion of the work piece surface so as to form a polishing path on the work piece surface
Implementation Method 2
the polishing area of the tool rotates around an axis substantially normal to the work piece surface
Data Source
Figure 1A~1B
Figure 2~3
Figure 4~5
AI summary
A method of polishing a work piece with a tool includes steps of effecting a relative movement between polishing area of the tool (20) and the work piece with engaging the polishing area of the tool (20) with a portion of the work piece surface so as to form the polishing path (30) on the work piece surface; wherein: the relative movement includes a first relative movement component; and a second relative movement component, oscillating the polishing area of the tool (20) and the work piece toward and away from each other about the first relative movement component in a first and second opposite directions substantially normal to a direction of the first relative movement component; wherein: a polishing mark formed by the engagement of the polishing area of the tool (20) and the work piece during the oscillation in the first direction is polished by their engagement in the oscillation in the second direction. A system of polishing a work piece with a tool is also disclosed. This is helpful for increasing the polishing quality because the tool keeps in contact with the work piece reducing errors that may be introduced by the disengagement of the tool and resumption of the engagement from a new start point. Besides, the operation efficiency of the robot system may be improved.