Oscillating Substrate Boundary Layer for Gas Flow Conformality
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Solution Overview
Problem
The slower flow of gases in the boundary layer adjacent to substrates during processing operations limits chemical reactions and reactant flow, hindering processing efficiency and conformality.
Innovation Solution
Oscillating the boundary layer by varying pressure, gas flow rate, or substrate height during processing to enhance gas flow dynamics and reactant delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a boundary layer exists adjacent to the substrate surface during gas flow, then the gas flow is stable and easy to control, but the slower flow in the boundary layer limits chemical reactions and reactant flow to the substrate
Solution Approach 1:
The patent applies dynamics by oscillating the substrate support structure during processing, causing the substrate to move periodically relative to the gas flow. This dynamic motion disrupts the boundary layer that would otherwise form adjacent to the substrate surface, enhancing reactant delivery and chemical reaction rates while maintaining overall process stability
Solution Approach 2:
The patent implements periodic action through oscillatory motion of the substrate support at controlled frequencies and amplitudes. This periodic movement creates time-varying flow conditions that prevent boundary layer stagnation, continuously refreshing the reactant supply to the substrate surface and improving both throughput and conformality
2Productivity
If the boundary layer flow velocity is reduced near the substrate surface, then the gas flow is more stable, but chemical reaction rates and reactant delivery are limited
Solution Approach 1:
The system transitions from static to dynamic operation by oscillating the substrate support, creating time-varying relative motion between the substrate and gas flow. This dynamic approach allows the boundary layer to be periodically disrupted, enhancing reactant delivery speed without sacrificing overall flow stability
Solution Approach 2:
The patent employs mechanical vibration through oscillatory motion of the substrate support structure. This vibration introduces kinetic energy into the boundary layer, preventing stagnation and enhancing mass transport of reactants to the substrate surface, thereby increasing reaction rates while maintaining controlled flow conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves throughput, reduces downtime, and increases conformality, especially for substrates with high aspect ratios, by facilitating better effusion and chemical reaction rates.
Implementation Method 1
A boundary layer for the flow of gas can exist adjacent to the surface of the substrate. The slower flow of gases in the boundary layer can limit chemical reactions of reactants and can limit flow of reactants to the substrate
Implementation Method 2
oscillating a boundary layer of the flow of one or more process gases while the flow of one or more process gases moves over the surface of the substrate. The oscillating the boundary layer includes one or more of: oscillating a pressure of the interior volume, oscillating an amount of the one or more process gases introduced into the interior volume, oscillating a height of the substrate in the interior volume
Data Source
AI summary
Aspects of the present disclosure generally relate to oscillating a boundary layer of a flow of process gas in methods and systems for processing substrates. In one aspect, one or more of a pressure, a gas flow rate, and/or a height of a substrate are oscillated during processing. In one implementation, a method of processing a substrate includes conducting a processing operation on the substrate in an interior volume of a processing chamber. The conducting the processing operation on the substrate includes moving a flow of one or more process gases over a surface of the substrate. The method also includes oscillating a boundary layer of the flow of one or more process gases while the flow of one or more process gases moves over the surface of the substrate.