Oscillator Circuit Board Layout for Smaller Chips and Larger Heaters
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Solution Overview
Problem
Existing quartz crystal oscillator devices face challenges in reducing the size of integrated circuit chips due to the need for input and output terminals on the active surface, which limits miniaturization and increases size.
Innovation Solution
A circuit board configuration where the semiconductor substrate has the oscillation circuit and heater on one surface and external electrodes on the opposite surface, with through electrodes for electrical coupling, allowing the heater and external electrodes to not overlap, enabling a smaller size and increased heat capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If input and output terminals are provided on the active surface of the integrated circuit chip, then signal transmission is enabled, but the size of the integrated circuit chip cannot be reduced
Solution Approach 1:
The patent moves the input and output terminals from the active surface (first surface) to the inactive surface (second surface) of the integrated circuit chip. This dimensional relocation allows the active surface to be fully utilized for circuit functions while the terminals are positioned on the opposite surface, enabling chip miniaturization without compromising signal transmission capability.
Solution Approach 2:
The patent employs through-electrodes that penetrate the entire thickness of the integrated circuit chip, nesting the terminal function within the chip structure itself. This allows terminals to be positioned on the inactive surface while maintaining electrical connection to the active circuit, effectively nesting the terminal function within the chip's three-dimensional structure.
2Device complexity
If heater and external electrodes are positioned on the same surface, then electrical connection is simplified, but the heater size is limited and heat capacity is reduced
Solution Approach 1:
The patent positions the heater and external electrodes on opposite surfaces of the integrated circuit chip. The heater is formed on the inactive surface (second surface) while external electrodes are on the active surface (first surface), utilizing the third dimension (chip thickness) to separate these components. This allows both components to have larger areas without overlapping, increasing heat capacity while maintaining electrical connection through through-electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall size of the oscillator device, enhances temperature stability, and improves oscillation characteristics by allowing for a larger heater and increased heat capacity without the need for wire bonding, thus maintaining stable frequencies.
Implementation Method 1
a heater (23) provided at a second surface (20b) side
Implementation Method 2
a plurality of through electrodes (24) penetrating the first surface (20a) and the second surface (20b) and electrically coupling the circuit (21) and the first external electrodes (22) or the heater (23)
Implementation Method 3
a piezoelectric vibrator element mounted on an integrated circuit
Data Source
AI summary
A circuit board includes: a semiconductor substrate including a first surface and a second surface located at an opposite side from the first surface; a circuit provided at a first surface side; a first external electrode provided at a second surface side; a heater provided at the second surface side; and a plurality of through electrodes penetrating the first surface and the second surface and electrically coupling the circuit and the first external electrode or the heater. The heater and the first external electrode do not overlap each other in a plan view.