Piezoelectric Oscillator Bond Layout to Prevent IC Chip Bending
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Solution Overview
Problem
In piezoelectric oscillators, the non-overlapping bonding positions between the base and IC chip and the IC chip and piezoelectric vibrator element lead to reduced bonding reliability due to bending of the IC chip during bonding, affecting the thickness reduction and size minimization demands.
Innovation Solution
A vibrator device design where the second bonding member overlaps the first bonding member in a plan view, ensuring effective pressing and bonding between the circuit element and the vibrator element, and a manufacturing method that includes specific steps for bonding and positioning these members to prevent bending and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the bonding portion between the base and IC chip and the bonding portion between the IC chip and piezoelectric vibrator element are formed at positions not overlapping each other in the plan view, then the structure is simpler and easier to manufacture, but the IC chip bends toward the base during bonding, reducing bonding reliability
Solution Approach 1:
The patent transitions from a non-overlapping planar arrangement to an overlapping arrangement of bonding portions in the plan view. This dimensional reconfiguration allows the bonding portions to be vertically aligned, enabling effective pressing force transmission during bonding while maintaining structural simplicity. The overlapping arrangement in plan view corresponds to a vertical stacking configuration in three-dimensional space.
2Length of moving object
If the IC chip thickness is reduced to meet size reduction demands, then the overall oscillator size is reduced, but the IC chip becomes more prone to bending during bonding, further reducing bonding reliability
Solution Approach 1:
The patent addresses the bending issue of thin IC chips by reconfiguring the bonding portion arrangement from non-overlapping to overlapping in the plan view. This vertical alignment creates a stable load path that compensates for the reduced chip thickness, allowing thin chips to maintain sufficient bonding reliability without requiring increased thickness.
Solution Approach 2:
The patent employs a pressing device that applies pressing force before the actual bonding process. This preliminary pressing action pre-positionsthe IC chip and bonding portions, ensuring proper alignment and preventing bending during the subsequent bonding operation. This preliminary action is particularly effective for thin chips that are prone to deformation.
3Reliability
If the bonding portion between IC chip and piezoelectric vibrator element is pressed during bonding, then bonding reliability is improved, but the IC chip bends toward the base due to pressing force, preventing effective pressing
Solution Approach 1:
The patent resolves the conflict between pressing force application and chip shape stability by arranging bonding portions to overlap in the plan view. This vertical stacking configuration ensures that pressing force is transmitted directly through the aligned bonding portions without causing lateral bending of the IC chip. The overlapping arrangement creates a stable force transmission path that maintains chip shape while achieving effective bonding pressure.
Data Source
AI summary
A vibrator device includes: a base having a first surface and a second surface in a front-back relationship with each other; a circuit element located at a first surface side of the base and having a third surface at the first surface side and a fourth surface in a front-back relationship with the third surface; a vibrator element located at a fourth surface side of the circuit element; a first bonding member that bonds the base to the circuit element; a second bonding member that bonds the circuit element to the vibrator element; and a lid bonded to the base so as to form a cavity that accommodates the circuit element and the vibrator element between the lid and the base, in which at least a part of the second bonding member overlaps the first bonding member in a plan view of the circuit element.