Oscillator Package Bonding Structure for Thermal Gap Control

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Solution Overview

Problem

Existing oscillators face challenges in improving heat insulation properties and frequency stability due to the need for precise application and stacking of multiple adhesive layers, restricting the position and amount of adhesive application.

Innovation Solution

A method of manufacturing an oscillator involves forming first and second projecting portions on the container and base substrate using insulating adhesive, allowing for independent bonding with a bonding material to increase the gap between the container and base substrate, enhancing heat insulation and frequency stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple layers of adhesive are stacked on the base substrate to increase the gap and improve heat insulation, then heat insulation properties are improved, but the position and amount of adhesive application become strictly restricted

Engineering Contradiction:

Improveheat insulation propertiesVSAvoidposition and amount of adhesive application

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The adhesive structure is segmented into two independent parts: first projecting portions formed on the container and second projecting portions formed on the base substrate. This segmentation allows each set of projecting portions to be formed independently with less stringent precision requirements, while still achieving the desired gap and heat insulation effect when bonded together.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bonding material acts as an intermediary that connects the first projecting portions and second projecting portions. This intermediary approach allows the two independently formed projecting portions to be joined together, achieving the cumulative gap effect without requiring precise stacking of multiple adhesive layers on a single substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If multiple layers of adhesive are stacked to increase the gap between container and base substrate, then heat insulation is improved, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveheat insulation propertiesVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into independent steps: forming first projecting portions on the container, forming second projecting portions on the base substrate, and then bonding them together. This segmentation simplifies each individual step compared to the complex multi-layer stacking process, while achieving the same or better gap effect.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first projecting portions are formed on the container in advance before the bonding step. This preliminary action allows the container side to be prepared independently, reducing the complexity of the final assembly process and enabling better control over the overall manufacturing process.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If the gap between container and base substrate is increased to improve frequency stability, then heat insulation is improved, but the adhesive application becomes more restricted

Engineering Contradiction:

Improvefrequency stabilityVSAvoidadhesive application ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The gap formation is achieved through segmented projecting portions on both the container and base substrate, rather than requiring a single thick adhesive layer. This segmentation makes the adhesive application easier for each individual layer while still achieving the total gap needed for frequency stability and heat insulation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The projecting portions provide localized adhesive application points with specific heights and positions, allowing the adhesive to be applied more easily in concentrated areas rather than requiring uniform thick adhesive layers across large surfaces. This local quality approach improves ease of manufacture while achieving the required gap for frequency stability.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach facilitates easier and more precise application of adhesive, resulting in improved heat insulation and frequency stability by increasing the gap between components, thus simplifying the manufacturing process and enhancing the oscillator's performance.

Implementation Method 1

bonding the first projecting portion and the second projecting portion with a bonding material interposed therebetween to mount the container on the base substrate

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS20260025120A1Method Of Manufacturing Oscillator

Publication Date: 2026.01.22 SEIKO EPSON CORP

AI summary

A method of manufacturing an oscillator is a method of manufacturing the oscillator including a container in which a resonator is accommodated and a base substrate, and the method includes forming a first projecting portion on the container, forming a second projecting portion on the base substrate, and bonding the first projecting portion and the second projecting portion with a bonding material interposed therebetween to mount the container on the base substrate.