Oscillator Power-Supply Capacitor Layout for Accurate Temperature Compensation
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Solution Overview
Problem
Existing oscillators face accuracy issues in temperature compensation due to environmental differences between measurement and implementation environments, leading to errors in parameter measurement and reduced accuracy of temperature compensation.
Innovation Solution
A circuit device with an inter-power-supply capacitor formed of at least two metal layers in the region where the temperature compensation circuit is disposed, which reduces the impact of external environmental factors on power supply impedance and improves capacitance, thereby enhancing the accuracy of temperature compensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the oscillator is measured and inspected in a different environment from its implementation environment, then the measurement process can be completed, but errors occur in the parameter measurement due to environmental differences
Solution Approach 1:
The patent applies equipotentiality by providing an inter-power-supply capacitor in the implementation environment that matches the measurement environment's power supply impedance. This creates equivalent electrical conditions (equipotential) between the measurement and implementation environments, eliminating environmental differences that caused measurement errors. The capacitor value is specifically designed to match the impedance characteristics, ensuring that parameters measured in one environment remain accurate when implemented in the other.
2Measurement precision
If the inter-power-supply capacitor is formed using metal layers in the temperature compensation circuit region, then the power supply impedance is stabilized and measurement accuracy is improved, but the layout space for the capacitor is limited
Solution Approach 1:
The patent utilizes the vertical dimension by forming the inter-power-supply capacitor using multiple metal layers stacked in the third dimension (z-axis) within the temperature compensation circuit region. Instead of expanding the layout area horizontally, the capacitor is constructed by stacking conductive layers separated by insulating layers, effectively using the vertical space above the substrate. This allows a large capacitance value to be achieved within a confined planar area, resolving the contradiction between measurement accuracy and layout space.
3Reliability
If the AC block and DC block are arranged separately to prevent interference, then malfunction due to interference is prevented, but the device complexity increases
Solution Approach 1:
The patent introduces a guard pattern as an intermediary element between the AC block (oscillation circuit) and DC block (temperature compensation circuit). This guard pattern acts as a shielding barrier that prevents electromagnetic interference between the two blocks while allowing them to be positioned closer together. The guard pattern is typically connected to a reference potential and creates an electromagnetic shield, enabling the AC and DC blocks to coexist in proximity without direct interference, thus reducing layout complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces errors in temperature compensation by stabilizing power supply impedance and increasing capacitance, leading to improved accuracy and reliability of temperature compensation across different environments.
Implementation Method 1
an inter-power-supply capacitor provided between a low-potential-side power supply line electrically continuous with the low-potential-side power supply pad and a high-potential-side power supply line electrically continuous with the high-potential-side power supply pad
Data Source
AI summary
A circuit device includes an oscillation circuit configured to cause a resonator to oscillate, a clock signal output circuit configured to output a clock signal based on an oscillation signal from the oscillation circuit, a temperature compensation circuit configured to perform temperature compensation on an oscillation frequency of the oscillation signal, a low-potential-side power supply pad to which low-potential-side electric power is supplied, a high-potential-side power supply pad to which high-potential-side electric power is supplied, and an inter-power-supply capacitor provided between a low-potential-side power supply line electrically continuous with the low-potential-side power supply pad and a high-potential-side power supply line electrically continuous with the high-potential-side power supply pad. The inter-power-supply capacitor is formed of at least two metal layers provided in a region where the temperature compensation circuit is disposed in a plan view.


