Oscillator Component Conductor Layer Distance Optimization
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Solution Overview
Problem
Existing electronic components with conductor layers to reduce frequency variation on mounting boards suffer from increased electrostatic capacitance, leading to unstable oscillation characteristics due to insufficient negative resistance.
Innovation Solution
Incorporating a conductor layer between the substrate surfaces of an electronic component with a specific distance range (0.35 mm to 0.7 mm) and area (1.65 mm2 to 2.0 mm2) to stabilize electrostatic capacitance and maintain oscillation stability, while using ceramic with a relative dielectric constant of 9 to 10 for the substrate to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between wiring and conductor layer is increased to reduce electrostatic capacitance, then oscillation stability is improved, but the component height increases
Solution Approach 1:
The patent optimizes the distance parameter within a specific range (0.35mm to 0.7mm) to achieve the right balance. This parameter optimization allows the electrostatic capacitance to be sufficiently reduced for oscillation stability while keeping the component height compact, resolving the contradiction between reliability and miniaturization.
Solution Approach 2:
The patent specifies using ceramic substrate with a relative dielectric constant of 9 to 10. This material selection affects the electrostatic capacitance characteristics, allowing for reduced capacitance values at practical distances, thus enabling both oscillation stability and compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the possibility of oscillation stability deterioration and allows for miniaturization by maintaining a low profile while ensuring stable oscillation characteristics and frequency control.
Implementation Method 1
the value of the electrostatic capacitance formed between a wiring pattern provided on the mounting surface of the substrate of the electronic component and the conductor layer provided in the substrate is increased
Implementation Method 2
an electronic component including an oscillation circuit that outputs a signal at a desired frequency using a resonator element formed from a piezoelectric body such as quartz crystal
Data Source
AI summary
An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.