On-Chip Oscillator Count Adjustment for IC Temperature Compensation

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Solution Overview

Problem

Integrated circuits (ICs) face challenges in maintaining optimal operation during field implementation due to variations in temperature and voltage, leading to increased power consumption and propagation delays, as existing temperature detection mechanisms like thermal diodes are difficult to implement and cause inaccurate adjustments.

Innovation Solution

A system comprising an oscillator, comparator, and control circuit fabricated on the IC, which generates and compares oscillator counts with reference counts stored in non-volatile memory to dynamically adjust operational parameters such as voltage, temperature, and clock speed, optimizing IC performance and reducing power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If thermal diodes are used for temperature detection, then temperature monitoring capability is provided, but circuit density and power consumption increase

Engineering Contradiction:
Improvetemperature detectionVSAvoidcircuit density
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts the temperature detection function from complex thermal diodes and implements it using a simple ring oscillator whose frequency naturally varies with temperature. This eliminates the need for additional temperature sensing circuitry while maintaining temperature monitoring capability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The ring oscillator serves multiple functions: it acts as both a timing reference for the IC and a temperature sensor simultaneously. The oscillator's frequency variation with temperature provides temperature information without requiring separate detection circuitry, thereby reducing circuit density.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If thermal diodes are used for temperature detection, then temperature monitoring capability is provided, but power consumption increases

Engineering Contradiction:
Improvetemperature detectionVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The patent removes the power-consuming thermal diode circuitry and replaces it with a ring oscillator that utilizes the natural frequency-temperature characteristic of the oscillator itself. This extraction of the temperature sensing function from separate hardware reduces overall power consumption.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The ring oscillator serves itself by using its own frequency variations (caused by temperature changes) as the sensing mechanism. This self-service approach eliminates the need for separate power-intensive temperature sensing circuitry, thereby reducing power consumption.

Inventive Principle:
Principle #25Self-service

3Reliability

If lookup table is used for temperature compensation, then compensation measures can be implemented, but compensation delay increases and power consumption increases

Engineering Contradiction:
Improvetemperature compensationVSAvoidcompensation delay
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent implements a feedback mechanism where the ring oscillator's frequency (which varies with temperature) is continuously monitored and used to dynamically adjust the operating parameters. This continuous feedback enables real-time compensation without the delays associated with lookup table methods.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system transitions from static lookup table compensation to dynamic real-time adjustment. The ring oscillator's frequency naturally tracks temperature changes, allowing the system to dynamically adapt operating parameters continuously rather than through discrete table lookups, thereby reducing compensation delay.

Inventive Principle:
Principle #15Dynamics

4Ease of manufacture

If fixed oscillation frequency is used in DRO, then oscillator operation is simplified, but temperature variation causes frequency drift

Engineering Contradiction:
Improveoscillator implementationVSAvoidoscillation frequency stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent makes the oscillator frequency dynamic rather than fixed. By allowing the ring oscillator's frequency to vary naturally with temperature and using this variation for compensation, the system maintains stability despite temperature changes, while still being simple to manufacture.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system exploits the natural parameter change (frequency variation) of the ring oscillator with temperature instead of trying to maintain a fixed frequency. This parameter change is harnessed for compensation purposes, achieving both ease of manufacture and frequency stability.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9766966B1Method and apparatus for on-chip adjustment of chip characteristics
Publication Date: 2017.09.19 MARVELL ASIA PTE LTD
  • US9766966B1 patent drawing
  • US9766966B1 patent drawing
  • US9766966B1 patent drawing

AI summary

Systems and methods are provided for optimizing operation of an integrated circuit. In one implementation, a system is provided for optimizing operation of an integrated circuit by adjusting an operational parameter of the integrated circuit based on a reference count stored in non-volatile memory fabricated on the integrated circuit. In another implementation, a method is provided for optimizing operation of an integrated circuit by generating, during operation of the integrated circuit, a first oscillator count of an oscillator, comparing the first oscillator count with at least one reference count stored on the integrated circuit, and activating, a control circuit to adjust an operational parameter of the integrated circuit based on a result of the comparison.