Oscillator Detection Circuit for Dual Clock IC Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit (IC) manufacturers face increased costs due to the need for two separate packaging options to accommodate ICs that can operate with either an external or internal clock, as customers specify their clock preference, leading to higher design and production expenses.
Innovation Solution
Incorporating a crystal-oscillator detector within the IC that uses a transistor and buffer to determine whether the crystal-out pad receives a reference-clock signal or is grounded, enabling or disabling the internal oscillator based on this detection, thereby reducing the need for additional bond pads and packaging options.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two separate packaging options are provided for external and internal clock configurations, then customer-specific clock preferences can be accommodated, but design and production costs increase
Solution Approach 1:
The IC package is designed with universal bond pads (first pad for external clock input, second pad for crystal oscillator output/select signal) that can serve multiple functions depending on configuration. The same physical package structure accommodates both external and internal clock modes without requiring separate packaging variants, thereby reducing packaging complexity while maintaining adaptability.
Solution Approach 2:
The IC incorporates an automatic detection mechanism that senses whether the second pad is connected to a crystal oscillator or grounded, and automatically configures the internal oscillator accordingly. This self-configuration eliminates the need for manual selection or separate packaging options, allowing a single package design to serve both clock configuration types.
2Adaptability or versatility
If two separate packaging options are provided for external and internal clock configurations, then customer-specific clock preferences can be accommodated, but design and production expenses increase
Solution Approach 1:
A single IC package design with multi-functional bond pads replaces the need for two separate packaging variants. The first pad accepts external clock signals or remains unused, while the second pad detects crystal oscillator connections or ground, enabling the same package to support both external and internal clock configurations, thereby simplifying manufacturing and reducing production costs.
Solution Approach 2:
The IC dynamically adapts its operation based on the detected configuration state. The automatic detection circuit senses whether the second pad is connected to a crystal oscillator or grounded, and the internal oscillator is accordingly enabled or disabled, allowing a single static package design to provide dynamic configuration adaptability without increasing production complexity.
3Adaptability or versatility
If an external-internal select bond pad is used to indicate clock type, then clock configuration can be specified, but the number of bond pads and packaging complexity increases
Solution Approach 1:
The second pad serves dual purposes: it outputs the reference clock signal when a crystal oscillator is connected, and simultaneously acts as the select signal input for the automatic detection circuit. By sensing whether this same pad receives a crystal oscillator signal or is grounded, the IC determines the clock configuration without requiring a separate select bond pad, thereby reducing the total bond pad area while maintaining configuration adaptability.
Data Source
AI summary
The present disclosure describes apparatuses and techniques for detection of an external oscillator. In some aspects, an integrated circuit includes an oscillator detector coupled to an external electrical connection. The oscillator detector may include a transistor having a gate coupled to the external electrical connection that is configured to detect a presence of an external oscillator.