Oscillator Protection via Heat Sink Integration
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Solution Overview
Problem
In image forming apparatuses, the oscillator is sensitive to changes in capacitance, leading to fluctuations in oscillation frequency, and existing solutions like using protective tapes increase manufacturing costs and complexity, while also requiring additional processes to prevent human contact and maintain clock function accuracy.
Innovation Solution
The oscillator and capacitor are positioned under a heat sink, which acts as a radiator, structurally preventing human contact and maintaining clock function accuracy without the need for protective tapes, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an oscillator-protecting tape is provided to prevent human contact with the oscillator, then the oscillator is protected from capacitance changes and frequency fluctuations, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent combines the protective function with the existing heat sink structure. The heat sink is designed to cover the oscillator, integrating protection against human contact into the thermal management component. This eliminates the need for separate protective tapes while maintaining oscillator reliability.
Solution Approach 2:
The heat sink serves dual purposes: thermal management and oscillator protection. By positioning the heat sink to cover the oscillator, the structure protects itself and sensitive components without requiring additional protective elements, simplifying the manufacturing process.
2Ease of manufacture
If the oscillator is exposed without protection, then the manufacturing process is simpler, but the oscillation frequency fluctuates due to human body contact changing capacitance
Solution Approach 1:
The protective function is merged into the heat sink structure. The heat sink is positioned to cover the oscillator, providing protection against human contact while maintaining thermal management functionality. This integration maintains manufacturing simplicity without compromising frequency stability.
3Reliability
If rectangular terminals with increased line width are used to apply power supply voltage, then power supply voltage fluctuations are reduced, but the wiring area increases
Solution Approach 1:
The patent transitions from two-dimensional planar terminals to three-dimensional立体的 power supply electrodes extending in the vertical direction. This vertical extension increases the effective power supply area without increasing the board's planar footprint, reducing voltage fluctuations while maintaining compact wiring area.
Solution Approach 2:
The invention changes the geometric parameters of the power supply connection by creating electrodes that extend vertically through or beyond the board surface. This parameter change increases the effective contact area for power supply without proportionally increasing the wiring area on the board surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively protects the oscillator from human contact and temperature fluctuations, ensuring stable clock function operation while reducing manufacturing complexity and costs by eliminating the need for protective tapes.
Implementation Method 1
a radiator that is provided at a position for covering the semiconductor integrated circuit and receives heat from the semiconductor integrated circuit and radiates the heat
Implementation Method 2
an oscillator that is provided in a space sandwiched between the board and the radiator and vibrates to supply a clock signal to the real-time clock circuit
Data Source
AI summary
An image forming apparatus includes: a board; a semiconductor integrated circuit that is provided on the board and has a real-time clock circuit; a radiator that is provided at a position for covering the semiconductor integrated circuit and receives heat from the semiconductor integrated circuit and radiates the heat; and an oscillator that is provided in a space sandwiched between the board and the radiator and vibrates to supply a clock signal to the real-time clock circuit.