Oscillator-IC Lead Frame Layout for Easier Semiconductor Assembly
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Solution Overview
Problem
Existing semiconductor devices with oscillators mounted on integrated circuits face challenges in manufacturing efficiency and versatility due to the need for precise terminal alignment and the use of bonding wires and anisotropic conductive adhesive films.
Innovation Solution
A semiconductor device configuration featuring an oscillator with external terminals, an integrated circuit with specific electrode pads, and a lead frame with terminals, where bonding wires connect the terminals and electrode pads, and a sealing member encapsulates the components for improved manufacturing efficiency and versatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an oscillator is mounted on an upper face of an integrated circuit with terminal alignment and bonding wires, then the device can be assembled, but manufacturing efficiency is poor and the process is complex
Solution Approach 1:
The patent merges the oscillator and integrated circuit into a single semiconductor chip structure. The oscillator unit is formed integrally with the integrated circuit on the same substrate, eliminating the need for separate mounting, terminal alignment, and bonding wire connections. This integration directly resolves the manufacturing efficiency issue by reducing assembly steps and process complexity.
2Ease of manufacture
If an oscillator is mounted on an integrated circuit through an anisotropic conductive adhesive film, then the components can be connected, but manufacturing efficiency is poor
Solution Approach 1:
The oscillator and integrated circuit are merged into a single monolithic structure on the same semiconductor substrate. This eliminates the need for anisotropic conductive adhesive films and separate mounting processes, thereby improving manufacturing efficiency and assembly speed by reducing the number of fabrication steps required.
3Adaptability or versatility
If terminal positions are matched between integrated circuit and oscillator, then connections can be made, but versatility is reduced
Solution Approach 1:
By integrating the oscillator unit directly with the integrated circuit on the same chip, the patent eliminates the need for separate terminal alignment between different components. The oscillator electrodes are formed in predetermined positions relative to the integrated circuit, removing the constraint of terminal position matching and enhancing device versatility without compromising connection precision.
Data Source
AI summary
A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.